Fatigue life estimation of FBGA memory device under vibration

Cinar, Yusuf; Jang, Gunhee

doi:10.1007/s12206-013-0946-5

Cited by 23 publications

(11 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The first is that of the response x(t) and denoted as X(v). The second is that of the input force f(t) and denoted as F(v) [27][28][29].…”

Section: Frequency Response Function (Frf)mentioning

confidence: 99%

“…The physical interpretation of the FRF is that a sinusoidal input force, at a frequency v, will produce a sinusoidal output motion at the same frequency. The output amplitude will be multiplied by [H(v)], and the phase, between output and input, will be shifted by [H(v)] [28,29]. Generally, two domains exist that are time domain and frequency domain.…”

Section: Frequency Response Function (Frf)mentioning

confidence: 99%

“…So smaller distortions in time domain data can be seen easily in frequency domain data. The time domain data is converted to frequency domain data by Fourier analysis [27][28][29]. LabVIEW 12.0 is used to acquire data i.e., force data from impact hammer and voltage data from accelerometer through DAQ.…”

Section: Frequency Response Function (Frf)mentioning

confidence: 99%

“…Mathematically, the area under a PSD-versusfrequency curve is equal to the variance, which is square of the standard deviation of the response. The random vibration analysis is done using ANSYS [28,29]. Input PSD is given in Table 3.…”

Section: Random Vibration Analysis Using Feamentioning

confidence: 99%

See 3 more Smart Citations

Finite element modeling and random vibration analysis of BGA electronic package soldered using lead free solder alloy − Sn-1Cu-1Ni-1Ag

Jayesh¹,

Elias²

2019

Int. J. Simul. Multidisci. Des. Optim.

View full text Add to dashboard Cite

As a result of the ban of lead from solder joints, many lead-free solder joints were developed. Most of the electronic equipment is subjected to random vibration. This study develops an analysis methodology based on finite element analysis and vibration tests to predict the failure and fatigue life of the electronic package soldered using Sn-1Cu-1Ni-1Ag under random vibration. A specially designed printed circuit board having ball grid array packages soldered is used in the study. Finite element model is developed in ANSYS and modal analysis was done. The finite element results were validated with experiments (impact test). Random vibration analysis was also done. These results were validated with random vibration experiments. Using the finite element results, it was predicted that the corner solder joints will fail first. It was observed in the random vibration experiment that corner solder joint failed first and the maximum stress generated was 12.8 MPa. Thus, Sn-1Cu-1Ni-1Ag is a promising lead-free solder joint alloy under random vibration combining with its mechanical properties.

show abstract

“…The first is that of the response x(t) and denoted as X(v). The second is that of the input force f(t) and denoted as F(v) [27][28][29].…”

Section: Frequency Response Function (Frf)mentioning

confidence: 99%

Section: Frequency Response Function (Frf)mentioning

confidence: 99%

Section: Frequency Response Function (Frf)mentioning

confidence: 99%

Section: Random Vibration Analysis Using Feamentioning

confidence: 99%

See 2 more Smart Citations

Finite element modeling and random vibration analysis of BGA electronic package soldered using lead free solder alloy − Sn-1Cu-1Ni-1Ag

Jayesh¹,

Elias²

2019

Int. J. Simul. Multidisci. Des. Optim.

View full text Add to dashboard Cite

show abstract

“…Non-destructive evaluation (NDE) of structures using their vibration responses for an early detection of structural damages has gained reputation over the years [1][2][3][4][5][6][7][8]. Understanding the dynamic behavior of damaged structures is an important step towards the structural damage detection, fault diagnosis and structural health monitoring.…”

Section: Introductionmentioning

confidence: 99%

Study of forced vibration response of a beam with a breathing crack using iteration method

2015

J Mech Sci Technol

View full text Add to dashboard Cite

A numerical model is developed to study the forced vibration characteristics of a beam structure with a breathing edge crack. The variable vibration characteristics of the beam induced by the crack breathing are considered in a theoretical model. An iteration numerical method is presented to solve the accurate forced vibration of the cracked beam considering its multiple vibration modes and the bilinearity. From numerical simulations, the satisfied iteration step length is obtained to get the accurate crack breathing frequency under a sinusoidal periodic excitation. The crack breathing frequency increases linearly when the excitation frequency changes from 0 to first resonant frequencies of the cracked beam; a non-linear variation of the crack breathing frequency is revealed with the further increasing of the excitation frequency. The proposed numerical model can be used to solve and study the vibration characteristics of beams with breathing cracks under various excitations.

show abstract

Fatigue Life Based Study of Electronic Package Mounting Locations on Printed Circuit Boards Subjected to Random Vibration Loads

Muthuram,

Saravanan

2024

J Electron Test

View full text Add to dashboard Cite

Fatigue life estimation of FBGA memory device under vibration

Cited by 23 publications

References 7 publications

Finite element modeling and random vibration analysis of BGA electronic package soldered using lead free solder alloy − Sn-1Cu-1Ni-1Ag

Finite element modeling and random vibration analysis of BGA electronic package soldered using lead free solder alloy − Sn-1Cu-1Ni-1Ag

Study of forced vibration response of a beam with a breathing crack using iteration method

Fatigue Life Based Study of Electronic Package Mounting Locations on Printed Circuit Boards Subjected to Random Vibration Loads

Contact Info

Product

Resources

About