Abstract:Solder bump inspection of flip chip has gained more attention with the widely use of flip chip package technologies in microelectronics packaging industry. A non-destructive testing method using ultrasonic excitation and modal analysis was presented for the detection of solder bump missing, a typical defect occurred in flip chip. The flip chip with arrayed solder bumps is modelled, and the effect of solder bump missing on the modal frequencies is investigated. The shifting of the natural frequencies of the ref… Show more
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