2023
DOI: 10.1016/j.actamat.2023.118816
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Fe segregation as a tool to enhance electrical conductivity of grain boundaries in Ti(Co,Fe)Sb half Heusler thermoelectrics

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Cited by 19 publications
(7 citation statements)
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“…In XYZ half-Heusler compounds, different grain boundary segregation behaviors of atoms occupying the X-site or Y-site have been observed. , For example, in the NbFeSb system, segregation of Nb was observed, while the VFeSb system exhibited Fe segregation. , Therefore, a more comprehensive investigation is required for various half-Heusler compounds to reveal the underlying causes of constituent element segregation and its implications on material properties.…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…In XYZ half-Heusler compounds, different grain boundary segregation behaviors of atoms occupying the X-site or Y-site have been observed. , For example, in the NbFeSb system, segregation of Nb was observed, while the VFeSb system exhibited Fe segregation. , Therefore, a more comprehensive investigation is required for various half-Heusler compounds to reveal the underlying causes of constituent element segregation and its implications on material properties.…”
Section: Discussionmentioning
confidence: 99%
“…Nanostructuring has been considered the most effective approach to overcome this limitation since grain boundaries and phase boundaries act as effective scattering centers for phonons, thereby reducing the lattice thermal conductivity while minimally impacting the electrical conductivity. Mechanical alloying followed by sintering is a widely employed method for the fabricating of nanostructured thermoelectric materials owing to its convenience and effectiveness to reduce the lattice thermal conductivity. Numerous studies have reported enhanced figure of merits attributed to the reduction in lattice thermal conductivity by using this approach. However, undesired secondary phases or micro- and nanosegregation can occur during the sintering process, which hampers the fine control of microstructures of materials. , Furthermore, oxidation or impurity contamination during ball milling and sintering processes can elevate lattice thermal conductivity and degrade the Seebeck coefficient, thereby resulting in deterioration of the thermoelectric properties. Moreover, the reduction in grain size is constrained as grain growth takes place during the consolidation process . For instance, Joshi et al reported that the initial grain size of Hf 0.75 Zr 0.25 NiSn 0.99 Sb 0.01 milled powder, approximately 50 nm, increased to over 200 nm after the hot-pressing process …”
Section: Introductionmentioning
confidence: 99%
“…The GB-dominated electron scattering has been reported in many fine-grained thermoelectric materials, including Mg 3 Sb 2 , [52] ZrCoSb, [42] NbCoSn, [81] GeTe, [68] and TiCoSb. [82] At larger grain sizes (>1 µm), the GBs are sufficiently far apart so that their contribution to the scattering term becomes negligible. Nevertheless, this would also rule out major contribution of GBs in phonon scattering and close down the design space of nanostructuring in thermoelectrics.…”
Section: Effect Of Grain Size On the Thermoelectric Propertiesmentioning
confidence: 99%
“…[39,40] However, the carrier grain boundary scattering could severely suppress the carrier mobility of SrTiO 3 -based thermoelectric ceramics. [41][42][43] Interface engineering is an effective way to reduce the scattering by lowering the energy barrier of grain boundaries, [44][45][46][47] and by realizing conduction band alignment to transport electrons and scattering phonons. [48] And in addition, the epitaxial growth of thin films with few grain boundaries could be another strategy.…”
Section: Introductionmentioning
confidence: 99%