Abstract:Thermal interface materials (TIMs), which can close the air gaps formed between rough component surfaces and ensure an efficient path for heat transfer, are directly related to the performance and reliability of power modules. [1,2] Conventional TIMs, such as greases, gels, and phase-change materials, are limited in high-temperature electronic packages because of their bottlenecks in heat removal and long-term reliability. [3] Silver paste, as a state-of-the-art TIM, has promising applications in hightemperatu… Show more
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