Feasibility of manufacturing of Al2O3–Mo HTCC by hybrid additive process

Bernard, M.; Pateloup, Vincent; Passerieux, Damien; Cros, Dominique; Madrangeas, Valérie; Chartier, Thierry

doi:10.1016/j.ceramint.2022.01.354

Cited by 8 publications

(6 citation statements)

References 20 publications

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“…According to equation (4), the transmission rate of electromagnetic wave in Al 2 O 3 was 9.56 × 10 7 m/s. In addition, the relative permittivity and relative permeability of Al 2 O 3 applied was 9.8 and 1 in this SiP device, respectively (Bernard et al , 2022). Then the theoretical transmission rate of electromagnetic wave was 9.57 × 10 7 m/s according to equation (3).…”

Section: Resultsmentioning

confidence: 97%

A failure location technology for SiP devices based on TDR nondestructive testing method

Xiao

Guo²,

Chen³

et al. 2023

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Purpose Traditional nondestructive failure localization techniques are increasingly difficult to meet the requirements of high density and integration of system in package (SIP) devices in terms of resolution and accuracy. Time domain reflection (TDR) is recognized as a novel positioning analysis technology gradually being used in the electronics industry because of the good compatibility, high accuracy and high efficiency. However, there are limited reports focus on the application of TDR technology to SiP devices. Design/methodology/approach In this study, the authors used the TDR technique to locate the failure of SiP devices, and the results showed that the TDR technique can accurately locate the cracking of internal solder joints of SiP devices. Findings The measured transmission rate of electromagnetic wave signal was 9.56 × 107 m/s in the experimental SiP devices. In addition, the TDR technique successfully located the failure point, which was mainly caused by the cracking of the solder joint at the edge of the SiP device after 1,500 thermal cycles. Originality/value TDR technology is creatively applied to SiP device failure location, and quantitative analysis is realized.

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Section: Resultsmentioning

confidence: 97%

A failure location technology for SiP devices based on TDR nondestructive testing method

Xiao

Guo²,

Chen³

et al. 2023

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“…The possibility of generating enclosed areas increased. The solidification of the remaining Sn-rich liquid caused shrinkage in the final state due to differences in the thermal expansion coefficients (10.05 × 10 −6 • C −1 for tin dioxide [34] and 7.1 × 10 −6 • C −1 for Alumina [35]). Therefore, shrinkage pores and poor interfaces were generated.…”

Section: Pores and Other Cast Defects Caused By Snmentioning

confidence: 99%

The Fatal Defects in Cast Al-Si Alloys Due to Sn Addition

Xiao,

Wang,

Deng

et al. 2023

Materials

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Cast defects are common in cast alloys and they are difficult to eliminate without deformation. They strongly degrade the mechanical properties of cast alloys. The addition of some elements can affect the number of cast defects. In this work, the deleterious effect of Sn addition on the mechanical properties of Al-Si alloys has been investigated via 3D-computed tomography, SEM and TEM. Amorphous Sn oxides were found near the alumina film or formed enclosures with alumina film. The melt containing high Sn content was trapped by enclosures, causing more shrinkage pores during solidification. Cracks likely initiated and expanded along these pores and brittle amorphous Sn oxides, deteriorating the mechanical properties. This work suggests not adding Sn to various Al alloys when used in a cast state.

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“…Multilayer ceramic substrates are mainly manufactured by HTCC or LTCC technology, which was originally derived from developments at RCA Corporation in the late 1950s [ 230 ]. To meet specific requirements, such as geometric complexity, microscale, multifunction, turnaround time, and cost-effectiveness, significant efforts have been devoted to realizing the multi-material 3D printing of multilayer ceramic substrates in the past few decades [ 22 , 189 , 190 , 191 , 231 , 232 , 233 , 234 ]. For example, Imanaka et al [ 190 ] proposed a hybrid multi-material integration process using the combination of established AJP, chemical etching, sputtering, and plating techniques to fabricate the mesoscale multilayer ceramic structure with fine copper electrodes and vias ( Figure 10 a): employing AJP to deposit high-permittivity BaTiO 3 films, chemical etching to selectively remove materials for shaping the via holes on the as-deposited BaTiO 3 films and internal electrodes on the Cu sputter films, and plating to realize the metallization of via holes.…”

Section: Applications Of Multi-materials 3d Printing In Functional Ce...mentioning

confidence: 99%

“…Significant mismatching of the coefficient of thermal expansion (CET) between alumina (CET = 7.1 × 10 −6 /°C) dielectric and tungsten (CET = 4.10 × 10 −6 /°C) conductors would cause delamination at the ceramic/metal interfaces during co-firing. To reduce such delamination risk, Bernard et al [ 234 ] replaced the tungsten paste used in experiments outlined by Raynaud et al with molybdenum (CET = 5.35 × 10 −6 /°C) paste and demonstrated molybdenum conductors in the HTCC structures perfectly followed the profile of the alumina dielectric after cofiring. Indeed, such a solution coupling SLA with DIW is an advancement for multi-material 3D printing of multilayer ceramic structures (e.g., substrates, solid oxide fuel cells, and customized ceramic electronics); however, it requires an expensive apparatus.…”

Section: Applications Of Multi-materials 3d Printing In Functional Ce...mentioning

confidence: 99%

“…To enhance the microwave dielectric properties, the polymer is removed by sintering the ceramic/polymer composites or is reserved for a specific function (e.g., flexibility). The aforementioned examples of multi-material 3D printing of microstrip antennas would likely have additional applications in filters [ 247 , 248 , 249 ], resonators [ 234 , 250 ], and isolators [ 251 ].…”

Section: Applications Of Multi-materials 3d Printing In Functional Ce...mentioning

confidence: 99%

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Recent Advances in Multi-Material 3D Printing of Functional Ceramic Devices

et al. 2022

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In recent years, functional ceramic devices have become smaller, thinner, more refined, and highly integrated, which makes it difficult to realize their rapid prototyping and low-cost manufacturing using traditional processing. As an emerging technology, multi-material 3D printing offers increased complexity and greater freedom in the design of functional ceramic devices because of its unique ability to directly construct arbitrary 3D parts that incorporate multiple material constituents without an intricate process or expensive tools. Here, the latest advances in multi-material 3D printing methods are reviewed, providing a comprehensive study on 3D-printable functional ceramic materials and processes for various functional ceramic devices, including capacitors, multilayer substrates, and microstrip antennas. Furthermore, the key challenges and prospects of multi-material 3D-printed functional ceramic devices are identified, and future directions are discussed.

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Feasibility of manufacturing of Al2O3–Mo HTCC by hybrid additive process

Cited by 8 publications

References 20 publications

A failure location technology for SiP devices based on TDR nondestructive testing method

A failure location technology for SiP devices based on TDR nondestructive testing method

The Fatal Defects in Cast Al-Si Alloys Due to Sn Addition

Recent Advances in Multi-Material 3D Printing of Functional Ceramic Devices

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