Feasibility Study of an Automated Assembly Process for Ultrathin Chips

Janek, Florian; Saller, E. J.; Müller, E.; Meißner, Thomas; Weser, Sascha; Barth, Maximilian; Eberhardt, W.; Zimmermann, André

doi:10.3390/mi11070654

Cited by 6 publications

(4 citation statements)

References 26 publications

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“…A chip on polyimide foil after acetone cleaning is displayed in Figure 4 . Further details about the ultrathin chip bonding process using a wafer dicing tape as a temporary chip carrier can be found in [ 29 , 30 ]. After cleaning, a layer of solder mask resist was spray coated onto the ultrathin chip.…”

Section: Resultsmentioning

confidence: 99%

Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist

et al. 2021

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This work presents an embedding process for ultrathin silicon chips in mechanically flexible solder mask resist and their electrical contacting by inkjet printing. Photosensitive solder mask resist is applied by conformal spray coating onto epoxy bonded ultrathin chips with a daisy chain layout. The contact pads are opened by photolithography using UV direct light exposure. Circular and rectangular openings of 90 µm and 130 µm diameter, respectively, edge length are realized. Commercial inks containing nanoparticular silver and gold are inkjet printed to form conductive tracks between daisy chain structures. Different numbers of ink layers are applied. The track resistances are characterized by needle probing. Silver ink shows low resistances only for multiple layers and 90 µm openings, while gold ink exhibits low resistances in the single-digit Ω-range for minimum two printed layers.

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Section: Resultsmentioning

confidence: 99%

Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist

et al. 2021

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“…For MEMS, vacuum tools can be used, if the movable parts are robust enough and/or the sensitive surfaces are far away from the vacuum point or the MEMS part is encapsulated [5,6]. If the chip is properly protected, it can be handled by standard vacuum pick and place tools [7].…”

Section: B Challenges For Mems Packaging and Handlingmentioning

confidence: 99%

Pick and Place of Sensitive Chips with Vacuum-Free Gecomer® Tools

Lorenz,

Ludewig,

Swiecinski

et al. 2024

IMAPSource Proceedings

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To cope the lack of suitable pick and place methods for sensitive chips, we present a new process using a gripper tool from the company INNOCISE called Gecomer®. The tool, made of polymer pillars, is using Van der Waals forces to create adhesion between the gripping tool and the chip surface. Hence, the tool works without any vacuum. While placing, the Van der Waals interactions are reduced by buckling those pillars resulting in a decreased contact area. The challenge is to find the right parameters to avoid a re-gripping of the chip during the Gecomer®-movement away from the chip. In this paper we present results on the placement accuracy including the reproducibility compared to a standard vacuum tool for different process parameters. For that, we used a pick and place machine with built-in inspection camera to examine the deviation from the target position. It is revealed that both vacuum and polymer gripper have a similar deviation of approx. ±15 μm. Hence, the placing accuracy is not negatively influenced by the Gecomer® tool and depends only on the machine parameters. Furthermore, we analyze the surfaces of the chips, whether there are any residues of the gripping tool. In a first optical inspection, no damages or residues could be found. The new vacuum-free pick and place process has the potential to open new opportunities in the assembly of sensitive (MEMS)- chips regarding reproducibility, accuracy, and process throughput.

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“…Established semiconductor technologies can be integrated into flexible electronics, so that this combination has the ability to be bendable, deformed into irregular shapes, or even stretched [ 15 , 21 ]. Flexible electronics consist of electronic components, such as surface-mounted devices (SMDs) or ultra-thin chips on flexible substrates [ 22 , 23 ]. The electronic components are not flexible by nature but are as thin as possible to provide flexibility as a complete system when integrating onto or in flexible substrates [ 23 , 24 ].…”

Section: Introductionmentioning

confidence: 99%

“…Flexible electronics consist of electronic components, such as surface-mounted devices (SMDs) or ultra-thin chips on flexible substrates [ 22 , 23 ]. The electronic components are not flexible by nature but are as thin as possible to provide flexibility as a complete system when integrating onto or in flexible substrates [ 23 , 24 ]. Bending strain is one of the main movements inducing cracks and leading to the malfunction of flexible structures [ 20 ].…”

Section: Introductionmentioning

confidence: 99%

Bending Setups for Reliability Investigation of Flexible Electronics

et al. 2021

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Flexible electronics is a rapidly growing technology for a multitude of applications. Wearables and flexible displays are some application examples. Various technologies and processes are used to produce flexible electronics. An important aspect to be considered when developing these systems is their reliability, especially with regard to repeated bending. In this paper, the frequently used methods for investigating the bending reliability of flexible electronics are presented. This is done to provide an overview of the types of tests that can be performed to investigate the bending reliability. Furthermore, it is shown which devices are developed and optimized to gain more knowledge about the behavior of flexible systems under bending. Both static and dynamic bending test methods are presented.

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Feasibility Study of an Automated Assembly Process for Ultrathin Chips

Cited by 6 publications

References 26 publications

Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist

Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist

Pick and Place of Sensitive Chips with Vacuum-Free Gecomer® Tools

Bending Setups for Reliability Investigation of Flexible Electronics

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