FEM-based thermal analysis of IGBT

Zhang, Jian; Lu, Cai‐Cheng; Huang, Yu-Jung; Xing, Meng

doi:10.1109/primeasia.2010.5604896

Cited by 12 publications

(3 citation statements)

References 3 publications

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“…As the power increases, the maximum and minimum temperature, and the difference between these two values at the surface increased. The result from module is close to the experiment [6] . FEM is a very useful tool for analyzing electric devices [7] , [8] .…”

Section: Introductionsupporting

confidence: 83%

Geometry Optimization for Increasing Fatigue Life of Pressing Packaged IGBT with SiC Chips and Silver Sintering Layers

Zheng

Cui

2022

J. Phys.: Conf. Ser.

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A novel SiC IGBT module packaging structure is proposed. Pressing packaging with silver sintering is adopted. The thermal analysis is made with FEM. A maximum temperature of 137°C is obtained when the module is working, which leads to significant fatigue problem. The minimum fatigue life of the fundamental model is 106, and it occurs in the upper silver layer nearby the SiC. Five improved models with different silver layer edge geometry are analyzed. It turns out that the best geometry optimization in this study can lead to a fatigue life of 141, that is, 33% higher than the fundamental model. This shows that a very subtle change in the geometry of the silver layer edge can lead to significant improvement of the fatigue life of the module. This result can provide useful reference for the design the third generation IGBT device.

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Section: Introductionsupporting

confidence: 83%

Geometry Optimization for Increasing Fatigue Life of Pressing Packaged IGBT with SiC Chips and Silver Sintering Layers

Zheng

Cui

2022

J. Phys.: Conf. Ser.

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“…[19][20][21][22][23] Even when voltage rises, the variance in the DC power produced by the solar cell proportionally rises with voltage and reaches the maximum point known as maximum power. 24,25 P m = V mpp* I mpp…”

Section: Modeling Of Pv With Maximum Power Pointmentioning

confidence: 99%

Solar powered electric vehicle using maximum power point tracking

Sharma¹,

Swami²

2022

MSEIJ

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The solar energy with its unrestrictedaccessibility is measuredas non-degradable, immortalkind of energy that discovers its mean in day by dayexercise. The utilization of solar vehicle is an initiative pace headed forplummetingcraving on the conformistenergy;exploit the non-renewable cause of control for a range of submissions. This paper majorly intended on the various applications of solar energy to gear up the utilization of electric vehicles. The Photo Voltaic (PV) elementsattached either in comparable or sequencemay be a superiorchoice, but expensive too. An electrical charge is merged from the PV panel and aimed to the output terminal to generate low power voltage. The charge controllers (CC)unswerving this power obtainedwith the solar panels to the batteries. The outcomes are based on the “design and simulation” of different constituents of the solar based electric vehicles. The PV cell has to be optimally effective at a meticulousposition to carry maximum power known asMaximum Power Point (MPP). Maximum power point tracking (MPPT) algorithm is exploited at this point. The dynamic behavior of electric motor (EM) is essential in regulate to estimate the concert of electric vehicles. These vehicles will be controlled in the forward as well as reverse direction with a speed of 48Kmph. The efficiency obtained for proposed solar vehicle is higher.

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“…Therefore, the adoption of computer simulation has greatly shortened the time for choosing apposite parameters to meet the design specifications [1][2][3]. Furthermore, difficult issues encountered in technical flow and theoretical analyses have been solved, the funding and human resources have been greatly reduced.…”

Section: Introductionmentioning

confidence: 99%

FE Based Thermal Analysis of Void Effect in IGBT Mechanical Module

Fang

Zhang

Gong

et al. 2012

AMR

Self Cite

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In this paper, a reasonable model under the thermal void effect of the Insulate Gate Bipolar Transistor is been built. Finite element analysis (FE) is introduced to analyze thermal characteristics of the model. The results indicate that the heat distribution of IGBT is determined of voids with different sizes, positions and the intensity. Besides, the synergy of void effect and heat coupling effect would significantly increase the temperature of the chip.

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FEM-based thermal analysis of IGBT

Cited by 12 publications

References 3 publications

Geometry Optimization for Increasing Fatigue Life of Pressing Packaged IGBT with SiC Chips and Silver Sintering Layers

Geometry Optimization for Increasing Fatigue Life of Pressing Packaged IGBT with SiC Chips and Silver Sintering Layers

Solar powered electric vehicle using maximum power point tracking

FE Based Thermal Analysis of Void Effect in IGBT Mechanical Module

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