Femtosecond laser ablation behavior of SiC/SiC composites in air and water environment

Weiv, Jiayong; Yuan, Songmei; Zhang, Jiaqi; Zhou, Ning; Zhang, Wei; Li, Jiebo; An, Wenzhao; Gao, Mengxuan; Fu, Yanzhe

doi:10.1016/j.corsci.2022.110671

Cited by 21 publications

(3 citation statements)

References 54 publications

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“…The microscopic morphology of 2.5-dimensional C/SiC composite grooves after laser ablation was investigated with the laser power of 80 W, scanning speed of 300 mm/s, scanning spacing of 20 μm, scanning times of 20, and scanning frequency of 50 kHz, as shown in Figure 8 . As can be seen from Figure 8 a,b, a large number of powder, loose, and porous ablative oxidation substances appeared on the bottom surface of the ablation groove, the carbon fiber and silicon carbide matrix were almost covered, with only a few fibers and matrix materials leaking out, and the trench bottom of fiber could be found on the bottom surface of grooves, and it was hypothesized that the appearance of this structure was caused by two factors: firstly, the thermal diffusion rate inside the material was not uniform, and the conduction rate along the fiber direction was faster than that in other directions [ 42 ]; secondly, when ablating, the diffuse reflection was produced on the surface of the processed material so that less carbon fiber or matrix material received more energy, and thus more material was removed [ 43 ]. The same phenomenon was found in Figure 8 c, where the bottom of the fiber trench could be observed, and the carbon fiber and silicon carbide matrix were almost covered, but some of the transverse fibers were found to be barely leaking out from the local magnified view, and the fibers and silicon carbide matrix were not uniformly removed at the same time, this was due to the different properties of carbon fiber and silicon carbide matrix materials, the sublimation temperature of SiC matrix was 2700 °C, while the sublimation temperature of carbon fiber was 3550 °C, which was higher than that of SiC, therefore, the carbon fiber was in an incomplete sublimation state and the ablation rate of SiC matrix was faster than that of C fiber [ 44 ].…”

Section: Resultsmentioning

confidence: 99%

Parameters Optimization of Laser-Grinding Chain for Processing Groove of 2.5-Dimensional C/SiC Composites

et al. 2023

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Aiming at problems such as poor precision of laser processing C/SiC composites, low efficiency of grinding C/SiC composites, and serious wear of grinding wheel, a method of laser-grinding chain processing C/SiC composite groove was proposed in this paper. The method combined the high efficiency characteristic of laser ablating and the high precision characteristic of grinding. The relationship between laser processing parameters and the characteristics of ablative grooves was investigated, and the appropriate laser processing parameters were optimized, and then, to further improve the processing quality of the grooves, the grinding parameters optimization experiments of the grooves of C/SiC composites were carried out. The results showed that the C/SiC composites could be quickly removed by laser processing, and the grooves with relatively good size and shape accuracy could be obtained by laser parameters optimization experiments, but the side wall of the groove still had a certain inclination and the surface quality of the groove was yet poor; meanwhile, the size accuracy, shape accuracy, and surface quality of the grooves were greatly improved by further grinding. In addition, then, through the laser and grinding optimization experiments, the optimized parameters were obtained, where the laser power was 80 W, the scanning speed was 300 mm/s, the scanning frequency was 50 kHz, the scanning spacing was 25 μm, the depth of cut was 30 μm, the liner speed of wheel was 62.832 m/min, and the feed speed was 10 mm/min. With these parameters, the time used to process the groove with the laser-grinding chain was about 23/40 of the grinding process, and the quality of grooves could be guaranteed. Therefore, combined with the optimized process parameters, the laser-grinding chain processing scheme could be used to achieve high efficiency and precision grinding of C/SiC composite grooves.

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Section: Resultsmentioning

confidence: 99%

Parameters Optimization of Laser-Grinding Chain for Processing Groove of 2.5-Dimensional C/SiC Composites

et al. 2023

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“…The equipment diagram for underwater processing is shown in Figure 10. In the water environment, the inhibition of oxidation reaction occurred via a water film during the decomposition process of SiC [104]. The temperature and oxygen content in the ablation area are the main reasons for corrosion mechanisms in both air and water.…”

Section: Underwater Laser Composite Processing Technologymentioning

confidence: 99%

A Review of Femtosecond Laser Processing of Silicon Carbide

Wang,

Zhang,

Chen

et al. 2024

Micromachines

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Silicon carbide (SiC) is a promising semiconductor material as well as a challenging material to machine, owing to its unique characteristics including high hardness, superior thermal conductivity, and chemical inertness. The ultrafast nature of femtosecond lasers enables precise and controlled material removal and modification, making them ideal for SiC processing. In this review, we aim to provide an overview of the process properties, progress, and applications by discussing the various methodologies involved in femtosecond laser processing of SiC. These methodologies encompass direct processing, composite processing, modification of the processing environment, beam shaping, etc. In addition, we have explored the myriad applications that arise from applying femtosecond laser processing to SiC. Furthermore, we highlight recent advancements, challenges, and future prospects in the field. This review provides as an important direction for exploring the progress of femtosecond laser micro/nano processing, in order to discuss the diversity of processes used for manufacturing SiC devices.

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“…A rule of practical significance in high-energy beam heat treatment is revealed, which is also applicable to SiC p /Mg composites etched by a pulsed laser. The energy beam power density q 0 of high-energy beam heat treatment is inversely proportional to the square root of its action time t, which indicates that the larger the power density of high-energy beam action, the shallower the hardening depth [ 28 , 29 , 30 , 31 , 32 , 33 ].…”

Section: Theorymentioning

confidence: 99%

Mechanism Analysis of Nanosecond Pulse Laser Etching of SiCp/Mg Composites

Song

Zhang

et al. 2022

Materials

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Due to the introduction of silicon carbide reinforcement, the physical and cutting properties of SiCp/Mg composites are very different from those of metal composites. Nanosecond pulse laser processing is more efficient than traditional processing for SiCp/Mg composites. A low-power pulsed fiber laser was used to etch 3.0 mm thick SiCp/Mg composites. The effect of low laser power (0~50 W) on the morphology and heat-affected zone of the SiCp/Mg composite after etching was studied. The results show that when the laser power increases, the material accumulation at the ablation end of the machining surface becomes more and more serious. With the increase in power, the differences in ablation width and ablation depth on the surface of composite materials do not increase proportionally. When the laser power increases gradually, the width of the heat-affected zone increases in the direction of the perpendicular laser beam and reaches the maximum value at the etched end.

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Femtosecond laser ablation behavior of SiC/SiC composites in air and water environment

Cited by 21 publications

References 54 publications

Parameters Optimization of Laser-Grinding Chain for Processing Groove of 2.5-Dimensional C/SiC Composites

Parameters Optimization of Laser-Grinding Chain for Processing Groove of 2.5-Dimensional C/SiC Composites

A Review of Femtosecond Laser Processing of Silicon Carbide

Mechanism Analysis of Nanosecond Pulse Laser Etching of SiCp/Mg Composites

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