2016
DOI: 10.3807/kjop.2016.27.4.127
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Femtosecond-Laser Micromachining of a Thermal Blocking Trench for an Enhanced PLC Variable Optical Attenuator

Abstract: In this paper, a trench structure was fabricated by femtosecond-laser machining to eliminate thermal crosstalk in a multichannel variable optical attenuator (VOA), to prevent decreasing attenuation efficiency of the VOA. Trenches of a variety of widths and depths were fabricated on the VOA chips by femtosecond-laser processing. After the machining, attenuation according to current change was observed in each VOA chip module with trenches. As a result, we could observe high responsivity of attenuation and low p… Show more

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