The ferroelectric material is an important platform to realize non-volatile memories. So far, existing ferroelectric memory devices utilize out-of-plane polarization in ferroelectric thin films. In this paper, we propose a new type of random-access memory (RAM) based on ferroelectric thin films with the in-plane polarization called "in-plane ferroelectric tunnel junction". Apart from nonvolatility, lower power usage and faster writing operation compared with traditional dynamic RAMs, our proposal has the advantage of faster reading operation and non-destructive reading process, thus overcomes the write-after-read problem that widely exists in current ferroelectric RAMs. The recent discovered room-temperature ferroelectric IV-VI semiconductor thin films is a promising material platform to realize our proposal.To meet the daily increasing demands of modern electronic devices, especially of portable devices, memories with low energy consumption and high performance are highly desired. The current commercial dynamic random-access memories (DRAM) are volatile, which consume a large amount of energy to refresh the stored data in order to prevent leakage from the capacitor. To reduce the energy consumption, a non-volatile memory might be the ultimate solution [1,2].The ferroelectric material has been proposed to be an ideal candidate for non-volatile memories due to its electric switchable bistable ground states since 1952 [3], and ferroelectricity based non-volatile memories have been developed rapidly in the past several decades [4,5].Depending on the readout mechanism, ferroelectric non-volatile memories can be roughly classified into two generations. The first generation of ferroelectric RAM (FeRAM) uses polarized charges in the ferroelectric capacitor to represent the data [6][7][8]. As a result, discharging the capacitor to measure the polarized charge destroys the stored data, and the capacitor needs to be recharged after the reading operation. Limited by the destructive reading process, the ferroelectric size effects [9, 10] and various practical issues such as fatigue [11] and imprint [12], the market of FeRAM remains relatively small.To overcome the destructive readout problem, the second generation of ferroelectric tunnel junction (FTJ) is proposed to probe the ferroelectric polarization using the tunneling electroresistance effect [13][14][15]. The basic structure of the FTJ is a metal-ferroelectric-metal junction, where the tunneling potential barrier is determined by the out-of-plane polarization in the ferroelectric layer. In this way, the FTJ realizes bistable resistance states. The major challenge of realizing FTJ is to fabricate ultrathin ferroelectric films so that the tunneling current surpasses the threshold of peripheral amplifiers. The depolarization field induced by the out-of-plane polarization dramatically suppresses the ferroelectric critical temperature or even destroys the ferroelectricity when the films are too thin [16][17][18][19].In this work, we propose a new type of ferroelec-tric memo...