Ferroelectric Hafnia-Based M3D FeTFTs Annealed at Extremely Low Temperatures and TCAM Cells for Computing-in-Memory Applications

Abstract

In order to overcome the bottleneck between the central processor unit and memory as well as the issue of energy consumption, computing-in-memory (CIM) is becoming more popular as an alternative to the traditional von Neumann structure. However, as artificial intelligence advances, the networks require CIM devices to store billions of parameters in order to handle huge data traffic demands. Monolithic three-dimensional (M3D) stacked ferroelectric thin-film transistors (FeTFTs) are one of the promising techniques for realizing high-density CIM devices that can store billions of parameters. In particular, oxide channel-based FeTFTs are well suited for these applications due to low-temperature processes, nonvolatility, and 3D integration capability. Nevertheless, the M3D-integrated CIM devices including hafnia ferroelectric films need the high-temperature annealing process to crystallize the ferroelectric layer, making M3D integration difficult. When the FeTFTs are fabricated with an M3D structure, the high-temperature process causes thermal issues in the underlying devices. Here, we present the focused microwave annealed (FMA) oxide FeTFTs with M3D integration at a low temperature of 250 °C. We confirmed that the FeTFTs with metal–ferroelectric-metal–insulator–semiconductor structure exhibited a large memory window of 3.2 V, good endurance over 106 cycles, and a long retention time of 105 s. To understand the different electrical characteristics of FeTFTs in the top and bottom layers, we experimentally analyzed the density of the state of the oxide channel and ferroelectric properties of the ferroelectric gate insulator by using multifrequency capacitance–voltage measurement and nucleation-limited-switching model analysis, respectively. With our approach, we demonstrate for the first time a vertical stacked FeTFTs-based ternary-content-addressable memory (TCAM) cell for CIM application. We believe that the proposed M3D-stacked TCAM cells composed of FeTFTs can be used in high-density memory, energy-efficient memory, and CIM technology.