“…Due to their superior ferroelectric, piezoelectric, and pyroelectric properties, ferroelectric materials have become multifunctional materials with wide application prospects in many fields, such as ferroelectric RAM (random access memory), transducers, pressure sensors, etc. − Due to the inability of known ferroelectric thin film materials to meet the performance requirements of device miniaturization, integration, and light-weight development, the search for and preparation of novel ferroelectric thin film materials is an ongoing topic of interest in the field of ferroelectrics . By the use of low-dielectric-constant ferroelectric thin film materials in ferroelectric field effect transistors (FETs), the voltage divider effect caused by the introduction of the buffer layer can be weakened so that the majority of the applied voltage is supplied to the ferroelectric layer rather than the buffer layer, thereby reducing energy loss, improving data storage time, and avoiding buffer layer breakdown . HfO 2 -based materials have a lower dielectric constant (ε r : 20–50) than perovskite-type ferroelectric film materials, on the same order of magnitude as that of commonly used buffer layer materials (Ta 2 O 5 : 25, Hf-Al-O:10–20), , but their application in memory is limited by the wake-up effect and the coercive electric field close to the breakdown electric field. , In addition to known ferroelectric materials, numerous paraelectric materials with a low dielectric constant have the potential to be converted into ferroelectrics.…”