Field-assisted diffusion bonding and bond characterization of glass to aluminum

Liu, C. R.; Zhao, Jinfeng; Lu, X. Y.; Meng, Qing Sen; Zhao, Ya-Pu; Munir, Zuhair A.

doi:10.1007/s10853-008-2583-4

Cited by 25 publications

(15 citation statements)

References 18 publications

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“…Schjolberg-Henrisken et al 15 studied the bonding parameters in the Al-glass system in some detail. A hermetic seal with a maximum bond strength of 18 MPa can be achieved when applying a voltage of 1000-1500 V for 20 minutes at temperatures ranging from 300 • C to 400 • C. These results are consistent with a more recent study by Liu et al 16 who produced glass/Al/glass dual interface joints and investigated the effect of bonding voltage and temperature: they found a doubling of the tensile bond strength when increasing the bonding temperature from 350 • C to 450 • C and a 2.5 fold increase when raising the applied voltage from 400 to 700 V.Apparently, temperature and applied voltage are the two key process variables, as they promote the formation of an intermediate bonding layer by accelerating the migration of ions into the glass. It is a generally accepted view, that anodic bonding is an electrochemical process in which at the anode, a metallic workpiece (Si, Kovar, Al or in this case a liquid tin solder alloy) is oxidized thus releasing metal cations which in turns electromigrate away from the anode into the glass matrix, creating an interfacial bonding layer.…”

supporting

confidence: 91%

Glass-to-Glass Anodic Bonding with Liquid Tin Based Fillers: A Mechanistic Study

Hawi

Gerussi

Koebel

2013

ECS J. Solid State Sci. Technol.

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A new variant of solid state anodic bonding termed activated liquid tin solder anodic bonding (ALTSAB) was recently developed. Here, we report the systematic investigation of bonding parameters temperature, bonding voltage and the alloy composition in a sandwich type configuration with soda-lime glass. Of the five different alloys tested (Sn, SnAl0.6, SnMg0.6, SnLi0.02 and SnLi0.06), SnAl shows the best mechanical integrity of the glass-metal-glass bonds and the lowest current density values during bonding. SnLi alloys entail very high bonding current densities up to 4 mA cm −2 at 270 • C and 800 V but poor mechanical performance due to alkali corrosion of the glass at the bonding interface. Supported by the large drift currents in the case of Li containing alloys, it is believed that the overall ALTSAB process is anode limited. With SnAl0.6 alloys, bonds with a shear strength >35 MPa can be produced in less than 7 minutes at a mere 270 • C. From temperature dependent data, apparent activation energies in the 70-100 kJ mol −1 range were extracted for all alloys, as it is expected for ion transport processes in soda lime glass. Compared to conventional anodic bonding, ALTSAB offers improved mechanical strength at far lower process temperature and voltage.For a number of technical applications, the ability to create hermetic seals of high durability and low gas permeation are essential for the overall system performance. In some cases, such as the packaging of oxygen sensitive organic light emitting devices (OLED) display panels, 1,2 photovoltaic elements, 3 microelectronic devices 4,5 and vacuum glazing, 6 more stringent tightness requirement excludes the use of rubber or polymer based sealant materials. 7,8 Especially when targeting extremely low gas permeation rates (water, oxygen), the use of inorganic sealants is almost indispensable. Metallic seals in particular are known to provide the highest barrier function due to their extremely low diffusivity values. 9 Very few examples of large area seals are known, where extreme tightness is required. One such system with a potentially large impact on society is the edge seal of a vacuum glazing, where the sum of permeation and outgassing rates 6 must not exceed 10 −12 mbar · l · s −1 . Traditionally, glass-to-metal seals are created by a brazing process, which is at a temperature significantly higher than 400 • C. Recently, we have reported an alternative method termed Activated Liquid Tin Solder Anodic Bonding (ALTSAB) 10 combining the advantage of perfect sealant adaptation to the surface with moderate process temperatures (below 300 • C) and high-vacuum compatibility. In this previous work, the ability of ALTSAB to produce glass-metal seals with excellent hermeticity and high toughness was demonstrated. When compared to standard soldering the sealing is achieved within one single step, so neither pre-nor post-treatments are required. The omission of glass premetallization and the perfect self-adaptation of the liquid metal sealant make ALTSAB a very promising tec...

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supporting

confidence: 91%

Glass-to-Glass Anodic Bonding with Liquid Tin Based Fillers: A Mechanistic Study

Hawi

Gerussi

Koebel

2013

ECS J. Solid State Sci. Technol.

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“…The electric current passing through the sample can provide an driving force to the chemical potential for diffusion, the use of an electric field (in reality a current) also increased the concentration of defects and vacancies, and enhances the nucleation rate of the new phases [11,[14][15]. The imposition of an external pressure contributes the particle arrangement and compact contact of each reaction layers, which will accelerate the process of combustion and add the product density.…”

Section: Fig 5 Images Of Interfacial Microstructures and Elements Dmentioning

confidence: 99%

“…Some nonstructural materials, like FeAl [9], NbAl 3 [10] has been successfully produced by this novel technique. In our previous works, some attractive materials have been prepared by FAPAS process [11][12]. In this experiment, the TiB 2 -TiC-Ni/TiAl/Ti functionally gradient materials was prepared by combining FAPAS processes and in-situ combustion synthesis.…”

Section: Introductionmentioning

confidence: 99%

Synthesis of TiB2-TiC-Ni/TiAl/Ti functionally gradient materials by FAPAS process

Liang

Chen

et al. 2011

Rare Metals

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Field-activated pressure-assisted synthesis (FAPAS) was used to prepare TiB 2 -TiC-Ni/TiAl/Ti functionally gradient materials. Interfacial microstructure and bonding strength of materials were mainly investigated. The microstructure, phase composition and distribution of elements of interface were analyzed by SEM, XRD and EDS. The shear strength and micro-hardness were also tested. The results show that the particles of TiB 2 -TiC composite ceramics prepared by FAPAS are fine and homogeneous disperse. Closely metallurgical bonding forms between layers by mutual diffusion of different elements across the interfaces. The maximum shear strength of joint reaches 85.878 MPa and the fracture occurs at the interface of cermet and TiAl. The micro-hardness of the sample changes gradually from titanium substrate to the cermet with a maximum hardness of 2760HV in the cermet.

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“…Some attempts have been made to go beyond sintering in SPS and try to do parallel welding/sintering during high temperature consolidation [7]. Examples are ZrB 2 -SiC [12], β-SiC [13], C/SiC composites [14] and SiCgraphite [15], dissimilar metals joining (Aluminum to stainless steel) [16], metal/glass joining [17], and Al 2 O 3 -ZrO 2 [18]. Dong et al [8] used SPS as a welding methodology to fabricate TiNi f /Al composite.…”

Section: Introductionmentioning

confidence: 99%

Towards a high strength ductile Ni/Ni3Al/Ni multilayer composite using spark plasma sintering

2019

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This paper is an attempt to develop an innovative high strength and ductile Ni/Ni3Al/Ni multilayer composite, using spark plasma sintering (SPS). Ni 3 Al powders were first synthesized by mechanical alloying of elemental pure Ni and Al powders. The synthesized intermetallic powders were then mixed with Ni powders in a way that a Ni/Ni 3 Al/Ni multilayer composite can be achieved. Scanning electron microscope, optical microscope, energy dispersive X-ray spectroscopy (EDS), microhardness, and shear punch tests were used to characterize microstructure and mechanical properties of the synthesized composite. Results show that a rather sharp interface with a perfect metallurgical bonding has formed at the Ni/Ni 3 Al joint. The synthesized multilayer composite has a perfect combination of strength and ductility. The maximum shear strength of Ni/Ni 3 Al/Ni multi-layer composite is significantly higher than that of Ni 3 Al, while its ductility is comparable to that of pure Ni.

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Field-assisted diffusion bonding and bond characterization of glass to aluminum

Cited by 25 publications

References 18 publications

Glass-to-Glass Anodic Bonding with Liquid Tin Based Fillers: A Mechanistic Study

Glass-to-Glass Anodic Bonding with Liquid Tin Based Fillers: A Mechanistic Study

Synthesis of TiB2-TiC-Ni/TiAl/Ti functionally gradient materials by FAPAS process

Towards a high strength ductile Ni/Ni3Al/Ni multilayer composite using spark plasma sintering

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