1993
DOI: 10.1109/16.249423
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Field inversion generated in the CMOS double-metal process due to PETEOS and SOG interactions

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Cited by 15 publications
(2 citation statements)
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“…covering on a silicon surface by with a carefully grown layer of SiO 2 , fixed oxide charge Q f is introduced which comes as a result of the excess (trivalent) silicon or excess oxygen centers (non-bridging oxygen) given up just at the vicinity of the Si-SiO 2 . Studies have shown that factors that determine the amount of fixed oxide charge present at Si-SiO 2 interface include carbon (probably -C x H y ) content in the deposited film, amount of hydrogen in all forms (Si-OH, H 2 O [ads], Si-H), deposition temperature (> 300 • C) and how well the Si-rich stoichiometry is exploited [3,4].…”
Section: Jinst 6 C12019mentioning
confidence: 99%
“…covering on a silicon surface by with a carefully grown layer of SiO 2 , fixed oxide charge Q f is introduced which comes as a result of the excess (trivalent) silicon or excess oxygen centers (non-bridging oxygen) given up just at the vicinity of the Si-SiO 2 . Studies have shown that factors that determine the amount of fixed oxide charge present at Si-SiO 2 interface include carbon (probably -C x H y ) content in the deposited film, amount of hydrogen in all forms (Si-OH, H 2 O [ads], Si-H), deposition temperature (> 300 • C) and how well the Si-rich stoichiometry is exploited [3,4].…”
Section: Jinst 6 C12019mentioning
confidence: 99%
“…Recently, SHG has been used to investigate oxide charge and interface state densities in alumina (Al2O3) on p-type silicon [3], and similar structures have been investigated for CMOS image sensor applications [4]. While the characterization of different dielectric interfaces on silicon based on SHG has been developed [3][4][5], little attention has been paid to oxide charge traps in SiO2/Si interfaces generated by different deposition techniques, such as PE-TEOS and HDP chemical vapor deposition (CVD) processes, even though the interface properties are strongly influenced by the deposition source [6,7].…”
Section: Introductionmentioning
confidence: 99%