Film assisted technology for the advanced encapsulation of MEMS/sensors and LEDs

Abstract

To meet the needs of ambient intelligence and the miniaturization of electronics, a MEMS/sensor package with exposed windows needs access to the environment. This presents a challenge for MEMS or sensor packaging/encapsulation. The exposed die and MEMS/sensor are brittle and can not withstand large stresses. By clamping a film around the chip's functional area, the surface of the chip is protected by film and the MEMS/sensors exposed window will be bleed and flash free. Relative to steel clamping force, the clamping force when using soft film is dramatically decreased. Film Assisted Molding (FAM) technology can meet the packaging demands of the MEMS and sensor functional opening area. FAM technology can fulfill the requirement of encapsulation of the advanced MEMS microsystems with low cost and excellent performance. Tiny exposed windows can be directly realized in the mold cap with film assisted transfer molding technology. This technology can be adopted to thru-mold vias for Package on Package (PoP) applications. Film assisted technology also opens the opportunity of wafer level transfer molding with an exposed window.The increasing demand for light emitting diodes (LEDs) has been driven by many applications, including communications, signage and large power solid state lighting (SSL). The LED encapsulation can be implemented by film assisted molding technology in die, package and module level. High power Solid state lighting (SSL) is a new promising lighting technology based the brightness light emetting diode (LED), which is promising to replace the conventional light sources for its economic and environmental saving. The encapsulation of SSL at die and module level is a challenge with low costs and high efficiency thermal management.