“…It has also been observed when, depositing Si 3 N 4 using Si 2 H 6 and NH 3 , [5], that the deposition rate starts to increase with the distance between lamp and substrate, reaches a maximum and starts again to decrease. This behavior can be explained considering that the deposition rate depends on the number of active species striking the wafer, which will depend on light intensity (for the correct range of wavelength capable of producing the photolysis of the gas) on the concentration of active species at a given distance from the substrate and on pressure.…”