Fin Pattern Effects on Air-Side Heat Transfer and Friction Characteristics of Fin-and-Tube Heat Exchangers with Large Number of Large-Diameter Tube Rows

Tang, Linghong; Zeng, Min; Xie, Gongnan; Wang, Qiuwang

doi:10.1080/01457630802304253

Cited by 61 publications

(20 citation statements)

References 19 publications

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“…Therefore, it is essential to investigate the heat transfer and friction characteristics of fin-and-tube heat exchangers with large number of tube rows and large tube-diameter (Xie [18], Tang et al [19,20]). …”

Section: Introductionmentioning

confidence: 99%

Parametric study and multiple correlations on air-side heat transfer and friction characteristics of fin-and-tube heat exchangers with large number of large-diameter tube rows

Xie

Wang

Sundén

2009

Applied Thermal Engineering

144

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Section: Introductionmentioning

confidence: 99%

Parametric study and multiple correlations on air-side heat transfer and friction characteristics of fin-and-tube heat exchangers with large number of large-diameter tube rows

Xie

Wang

Sundén

2009

Applied Thermal Engineering

144

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“…This implies that the heat transfer coefficient between the HFE and the cold plate has increased. It is known that heat transfer coefficients for heat exchangers are a function of the fluid velocity in that an increase in the velocity results in a corresponding increase in the heat transfer coefficient as reported by Tang et al [13]. The conclusion from this is that the HFE convective velocity must increase, which results in a process that can naturally regulate itself depending on the processor temperatures -a feature similar to the active control of server fan speeds based on thermal conditions.…”

Section: Configuration (Total Power Input)mentioning

confidence: 83%

Enclosed liquid natural convection as a means of transferring heat from microelectronics to cold plates

Hopton

Summers

2013

29th IEEE Semiconductor Thermal Measurement and Management Symposium

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Liquid immersion of datacom electronics can be configured as a cooling mechanism when components are in direct contact with a high dielectric strength liquid. This paper analyses the heat transfer capabilities of datacom electronics when they are enclosed in a cassette with a dielectric liquid and sandwiched against a cold plate positioned in parallel with the printed circuit board. A proxy server motherboard with controllable heat cells and temperature sensors is used to conduct a series of heat transfer experiments. The results of which demonstrate that the thermal conductance processes via the naturally convecting dielectric liquid improves as the power demand of the electronics increases.

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“…Experimental data and correlations for the heat and mass transfer rates of the finand-tube heat exchanger with varying fin types were obtained, including the plain fin (Wang, Chi et al 2000;Wang, Lin et al 2000a;Halici et al 2001), the wavy fin (Mirth and Ramadhynai 1993;1994;Wang et al 1999;Lin et al 2002;Dong et al 2007;Ma et al 2009), the slit fin (Wang et al, 2001;Ma et al 2009), and the louver fin (Wang, Lin et al 2000b;Ma et al 2009); the effects of fin pattern on the heat transfer and friction characteristics were analyzed, including plain fin, slit fin, and the fin with delta-wing longitudinal vortex generator (Tang, Zeng et al 2009). Numerical investigations of heat transfer and friction characteristics of heat exchangers with large diameter tubes were performed (He et al 2005;Singh et al 2008;Xie et al 2009;Tang, Min et al 2009). For designing the fin configuration, empirical equations developed based on the experimental data of heat exchangers were employed due to short time consumption and less resource requirement (Ding 2007).…”

Section: Introductionmentioning

confidence: 99%

Fin design for an evaporator with small diameter microgroove tubes

Jing-dan

Ding

et al. 2014

HVAC&R Research

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The application of fin-and-tube heat exchangers with small diameter microgroove tubes in room air conditioners has rapidly increased recently, and fins suitable for such heat exchangers should be developed. In the present study, a louver fin suitable for the evaporator with small diameter microgroove tubes was designed by applying computational fluid dynamics method, and the performance of the optimized and existing louver fins were experimentally investigated. Experimental results show that water bridge occurs at the bottom of the optimized fins for small diameter tubes, which is not the same as that for larger diameter tubes; for the fins of the evaporator with small diameter tubes, the increase of the fin pitch leads to the decrease of Colburn j factors. Based on the experimental data, a correlation of the Colburn j factor was developed to predict the heat transfer rate of the evaporator with small diameter microgroove tubes, and agrees with 85% of the experimental data within a deviation of ±20%.

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Fin Pattern Effects on Air-Side Heat Transfer and Friction Characteristics of Fin-and-Tube Heat Exchangers with Large Number of Large-Diameter Tube Rows

Cited by 61 publications

References 19 publications

Parametric study and multiple correlations on air-side heat transfer and friction characteristics of fin-and-tube heat exchangers with large number of large-diameter tube rows

Parametric study and multiple correlations on air-side heat transfer and friction characteristics of fin-and-tube heat exchangers with large number of large-diameter tube rows

Enclosed liquid natural convection as a means of transferring heat from microelectronics to cold plates

Fin design for an evaporator with small diameter microgroove tubes

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