Fin-shape optimization of an impingement-parallel plate heat sink

Abstract

As the power dissipated by advanced microelectronic devices continues to increase, the demand for reliability also increases. This increases the requirements on the thermal performance of every part of the system, including the heat sink. One of the objectives of this study is to examine the effect of shape of the heat sink fins on the thermal performance of the system. The pressure gradient from the fan to the base of the heat sink, near the center, tends to be high. This significantly reduces the airflow at that location and, hence, decreases transport in that region. Parallel plate heat sinks have been investigated by removing fin material near the center along the length and height of the fins. The junction-to-ambient temperature difference and pressure drop are adopted as thermal performance characteristics. Five design variables related to the fin shape were considered and the most significant influential geometric parameters for minimizing the objective functions identified using the analysis of variance (ANOVA) approach. Different fin shapes have been studied with the objective of searching for a new optimal heat sink design by optimizing the variables that improve the thermal performance without increasing pressure drop across the heat sink.

Local and global dimensional CFD simulations and analyses to optimize server-fin design for improved energy efficiency in data centers

“…The former is reviewed below. There are a large number of papers that deal with aerodynamic and thermodynamic factors for chip cooling; they cover thermal management for microprocessor devices with fm-shape optimization [3], stochastic optimization [22], fin design with synthetic small dimension turbulent jets [6], optimal spacing between heat-generating blocks [8], and sensitivity analysis and optimization of a pin fin heat sink and the orientation of intake flows [19]. Previous pin-fin models change the spacing intervals and fin-length.…”

“…From the static thermodynamic viewpoint, the main interest has been to keep server temperature below a defmed redline. On the other hand, on the local scale, aerodynamic effects are considered, i.e., multiple flat fins for chip cooling [3,39]. At both scales, vortexes generated from bodies in the data center can change the distributions of 978-1-4799-5267-0114/$31.00 ©20 14 IEEE temperature, velocity, and pressure over time.…”

Design Optimization of Plate-Fin Heat Sink with Forced Convection for Single-Module Thermoelectric Generator

“…For complex designs, computational fluid dynamics (CFD) techniques have been used to optimize heat sink geometries since no analytical expressions for both thermal and fluid flow behavior are available. Thus, for example, Gondipali et al [19] optimized the geometry of parallel plate heat sinks with removed material near the center of the plates so as to enhance the airflow at that location. Al-Damook et al [20] optimized the geometry of pin heat sinks with rectangular slots and with notches including fan power consumption and heat sink mass requirements.…”