2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) 2021
DOI: 10.1109/itherm51669.2021.9503273
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Finding the minimum quantity and the optimum placement of on-die temperature sensor in SOC design based on rank analysis

Heeseok Lee
1
,
Yunhyeok Im
2
,
Taekeun An
3
et al.
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Cited by 2 publications
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References 32 publications
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Singular Value Decomposition (SVD) based Thermal Resistance Matrix (TRM) Size Reduction for Fast Optimization of On-Die Floorplan and Temperature Sensor Placement

Jo
1
,
Lee
2
,
Kim
3
et al. 2023
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
1
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Singular Value Decomposition (SVD) based Thermal Resistance Matrix (TRM) Size Reduction for Fast Optimization of On-Die Floorplan and Temperature Sensor Placement

Jo
1
,
Lee
2
,
Kim
3
et al. 2023
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
1
0
0
0
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Multi-resolution method for thermal resistance matrix based on 2D Haar wavelet

Lee,
Pak,
Joo
et al. 2024
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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