Fine Copper Lines with High Adhesion on High Rigidity Dielectrics

Nishida, M.; Noma, Hirokazu; Iwakura, T.; Yamaguchi, Masaki; Mitsukura, Kazuyuki

doi:10.1109/ectc51906.2022.00142

Cited by 3 publications

(1 citation statement)

References 30 publications

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“…With the reduced pitch between leads and repeated soldering, reliability issues can arise, such as the formation of conductive bridges (shorts) leading to non-functional devices. Moreover, a decreased pitch between leads can cause the faster growth of dendrites, which can ultimately result in device failure as was shown in studies [ 1 , 2 , 3 , 4 , 5 , 6 ].…”

Section: Introductionmentioning

confidence: 99%

A Novel Approach for Temperature-Induced Ball Grid Array Collapse Observation

Sorokina,

Dušek,

Bušek

2024

Materials

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This study presents a new approach to investigating the impact of repeated reflow on the failure of ball grid array (BGA) packages. The issue with the BGA package collapse is that the repeated reflow can lead to short circuits, particularly for BGAs with a very fine pitch between leads. A novel approach was developed to measure the collapse of BGA solder balls during the melting and solidification process, enabling in situ measurements. The study focused on two types of solders: Sn63Pb37 as a reference, and the commonly used SAC305, with measurements taken at various temperatures. The BGA samples were subjected to three different heating/cooling cycles in a thermomechanical analyzer (TMA) at temperatures of 250 °C, 280 °C, and 300 °C, with a subsequent cooling down to 100 °C. The results obtained from the TMA indicated differences in the collapse behavior of both BGA solder alloys at various temperatures. Short circuits between neighboring leads (later confirmed by an X-ray analysis) were also recognizable on the TMA. The novel approach was successfully developed and applied, yielding clear insights into the behavior of solder balls during repeated reflow.

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