“…1,2 To date, a variety of device fabrication methods using this technique have been proposed, including those for the fabrication of electrooptic devices, 35 gas sensors, 68 electrochromic devices (ECDs), 9 interconnections for circuitry on a printed-circuit board (PCB), 10 thin-film transistors (TFTs), 11 organic light-emitting diodes (OLEDs), 12 large-area displays, 13 and radio frequency identification (RFID) tags. 14,15 For patterning electrodes and wires of the devices, metal nanoparticles, such as Au, 1517 Ag, 18,19 and Cu 20,21 have been studied as promising ink particles, since the particles exhibit good dispersibility in solvents through coating of the particle surfaces with organic monolayers, and they form flexible films with high metal content after being cured.…”