Fine Pitch (≤ 10μm) Die to Wafer Cu-Cu TCB on Organic Polymer Build Up Films

Harish, Vineeth; Sahoo, Krutikesh; Zheng, Kai; Park, Gilbert; Chen, Han-Wen; Verhaverbeke, Steven; Iyer, Subramanian S.

doi:10.1109/ectc51529.2024.00392

2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024

DOI: 10.1109/ectc51529.2024.00392

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Fine Pitch (≤ 10μm) Die to Wafer Cu-Cu TCB on Organic Polymer Build Up Films

Vineeth Harish,

Krutikesh Sahoo,

Kai Zheng

et al.

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Fine Pitch (≤ 10μm) Die to Wafer Cu-Cu TCB on Organic Polymer Build Up Films

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References 15 publications

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