Fine Pitch Au-SnAgCu Joint-in-via Flip-Chip Packaging

Lee, Teck Kheng; Zhang, Sam; Wong, Chee Cheong; Tan, A.C.

doi:10.1109/eptc.2007.4469722

2007 9th Electronics Packaging Technology Conference 2007

DOI: 10.1109/eptc.2007.4469722

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Fine Pitch Au-SnAgCu Joint-in-via Flip-Chip Packaging

Teck Kheng Lee

Sam Zhang

Chee Cheong Wong

et al.

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Fine Pitch Au-SnAgCu Joint-in-via Flip-Chip Packaging

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References 12 publications

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