Fine pitch TAB/OLB (Tape Automated Bonding/Outer Lead Bonding) technology by soldering method through non-cleaning process

Abstract

We have developed a fine pitch TAB/OLB (Tape Automated BondingIOuter Lead Bonding) technology by soldering method through non-cleaning process. This technology made it possible to bond the outer leads of the TCP (Tape Carrier Package) at 0.15" pitch onto a substrate without a solder supply on the substrate electrodes, which reduces the substrate cost and simplifies the wiring pattern on the substrate, thereby decreasing the electronic noise due to the common electrode pattern for electro-plating.We studied the bonding conditions, materials, reliabilities and a repair technique, and we confirmed that the developed technology can be put into practical use.