2001
DOI: 10.1016/s0304-8853(01)00038-5
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Fine structure and possible growth mechanisms of some electrodeposited CuCo granular films

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Cited by 17 publications
(7 citation statements)
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“…From Figure 7a, the furcation of ZFC/FC curves emerged at nearly 300 K, and there is no magnetization maximum in the ZFC curve across the measured temperature range, implying that the superparamagnetic blocking temperature should be higher than 300 K, that is, the Co 34 Cu 66 NTs are ferromagnetic at 300 K. Moreover, it was observed that the magnetization has a sharp increase at the lowtemperature range of 5 to ∼25 K, and this is a different feature as compared to the continuous Co-Cu alloy films reported before. 35,36 One possible explanation is that we are observing the high-temperature flank of a peak with a maximum magnetization well below 5 K. It can arise due to the extremely small magnetic particles produced during the electrodeposition. This should be reasonable since we have preliminarily confirmed the presence of very small hcp Co nanoclusters according to the XRD and ED results mentioned previously.…”
Section: ) Kλ β Cos θmentioning
confidence: 94%
“…From Figure 7a, the furcation of ZFC/FC curves emerged at nearly 300 K, and there is no magnetization maximum in the ZFC curve across the measured temperature range, implying that the superparamagnetic blocking temperature should be higher than 300 K, that is, the Co 34 Cu 66 NTs are ferromagnetic at 300 K. Moreover, it was observed that the magnetization has a sharp increase at the lowtemperature range of 5 to ∼25 K, and this is a different feature as compared to the continuous Co-Cu alloy films reported before. 35,36 One possible explanation is that we are observing the high-temperature flank of a peak with a maximum magnetization well below 5 K. It can arise due to the extremely small magnetic particles produced during the electrodeposition. This should be reasonable since we have preliminarily confirmed the presence of very small hcp Co nanoclusters according to the XRD and ED results mentioned previously.…”
Section: ) Kλ β Cos θmentioning
confidence: 94%
“…[5][6][7] The process has several advantages such as the ability to produce powders in their pure form and with metastable phases. [8][9][10] Electrodeposition is a versatile technique offering various parameters such as current density, overpotential, electrolyte composition, temperature, substrate agitation, etc., which can be used to control the morphology, microstructure, and composition of the deposits. Among these parameters, the effect of potential ͑or current density͒ has been studied extensively and has substantial effect on the morphology of the deposits.…”
mentioning
confidence: 99%
“…Low activation energy for formation of stacking faults could easily lead to formation of both phases in the samples. According to Tochitskii et al [27], considering firstly the deposition of single Cu element, the impurities in the form of SO À 4 and OH À ions, together with hydrogen, might be incorporated into the growing film as deposition proceeds. As a consequence, a retardation of growth (or passivation) of copper at the particular areas at the substrate surface may be observed.…”
Section: Film Growthmentioning
confidence: 99%