Finishing of Deep Concave, Aspheric, and Plano Surfaces Utilizing the UltraForm 5-Axis Computer Controlled System

Bambrick, Scott; Bechtold, Michael; DeFisher, Scott; Mohring, David; Meisenzahl, Joe

doi:10.1364/oft.2008.othd5

Cited by 2 publications

(1 citation statement)

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“…However, applications to other difficult-to-polish materials with similarly high mechanical properties [e.g. polycrystalline alumina (PCA), aluminium oxynitride (AlON)] have been reported [73].…”

Section: New Technologiesmentioning

confidence: 99%

Machining processes for sapphire wafers: a literature review

Pei

Funkenbusch

2011

Proceedings of the Institution of Mechanical Engineers, Part B:

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Sapphire wafers are widely used as the substrates for fabricating GaN light-emitting diodes (LEDs). The quality of LEDs depends directly on the quality of the sapphire wafers. A series of machining processes is required to turn sapphire barstock into wafers with the desired geometry and surface quality. This paper reviews the literature on various machining processes for sapphire wafers: slicing (including outer diameter cut-off grinding, inner diameter cut-off grinding, loose abrasive multi-wire sawing, fixed abrasive slicing, and fixed abrasive multi-wire sawing), flattening (including lapping and grinding), and surface finishing (including mechanical polishing and chemical mechanical polishing). New machining technologies are also introduced.

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Section: New Technologiesmentioning

confidence: 99%

Machining processes for sapphire wafers: a literature review

Pei

Funkenbusch

2011

Proceedings of the Institution of Mechanical Engineers, Part B:

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Recent Advancements in Machining With Abrasives

Guo¹,

Shi

Mullany

et al. 2020

Journal of Manufacturing Science and Engineering

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This paper presents the recent advancements and forthcoming challenges for abrasive machining with specific focus on the advancement of industrial applications. The most significant advancement of abrasive machining is in grinding applications of Cubic Boron Nitride (CBN) abrasive. The advancement of CBN wheels, application of grinding models and simulation tools, development of high stiffness multi-axis grinding machines and high-speed spindles have contributed to the growing industrial applications of grinding with plated and vitrified CBN wheels. Sustainability of abrasive machining also received more attention during the past two decades as global Fortune 500 corporations have included sustainability as a corporate goal. Abrasive machining will continue to be a critical process for manufacturing precision components in the decades to come. The advancement and adoption of additive manufacturing creates more unique challenges for abrasive machining of complex geometrical features which were impossible a few years ago. Furthermore, strategies for abrasive machining are needed to utilize the massive amount of process data available by connected factories. Therefore, it is expected that sustainability and data analytics for abrasive machining will become a more important focus for various manufacturers.

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Finishing of Deep Concave, Aspheric, and Plano Surfaces Utilizing the UltraForm 5-Axis Computer Controlled System

Cited by 2 publications

References 0 publications

Machining processes for sapphire wafers: a literature review

Machining processes for sapphire wafers: a literature review

Recent Advancements in Machining With Abrasives

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