Finite element analysis of lead-free surface mount devices

Hegde, Pradeep; Ochana, Andrew R.; Whalley, D.C.; Silberschmidt, Vadim V.

doi:10.1016/j.commatsci.2007.07.046

Cited by 14 publications

(15 citation statements)

References 6 publications

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“…The present paper continues the previous work [3], where an elasto-plastic behaviour of the solder joint at thermal cycling was studied for assumed both uniform and non-uniform temperature distributions in the 1206 chip resistor assembly. This paper focuses on a creep behaviour of solders under powercycling.…”

Section: Introductionsupporting

confidence: 54%

“…The geometry used for finite element analysis is the one used in the experiment. The geometric dimensions for both 2D and 3D are similar to those used in [3].…”

Section: Geometry and Materialssupporting

confidence: 49%

“…The material properties used to model a ceramic component, copper pad and FR4 are the same as in [3]. The undertaken studies showed that powercycling induces stress levels in solder joints beyond yield and temperature ranges between 0.55T h and 0.68T h .…”

Section: Geometry and Materialsmentioning

confidence: 99%

“…The temperature measuring technique is similar to the one described in [3]. Thermal radiation from the surface, which has a wavelength spectrum dependent on its temperature, structure and composition of the surface, is measured in the experiment.…”

Section: Methodsmentioning

confidence: 99%

“…where A = 277984, α = 0.02447, n = 6.41, H/R = 6500. cr   is a steady state-creep strain rate, σ is a stress level, T is absolute temperature [3].…”

Section: Geometry and Materialsmentioning

confidence: 99%

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Creep damage study at powercycling of lead-free surface mount device

Hegde

Whalley

Silberschmidt

2009

Computational Materials Science

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Soldering is extensively used to assemble electronic components to printed circuit boards or chips to a substrate in microelectronic devices. These solder joints serve as mechanical, thermal and electrical interconnections, therefore, their integrity is a key reliability concern.However, newly introduced lead-free solders do not have a long history of applications in the industry and there is a lack of established material models of their behaviour over the wide temperature range experienced by electronics systems. Therefore, an extensive reliability study is required before introducing a new lead-free solder material in the electronic industries. Moreover, most of the solder materials have low melting temperatures, and are prone to creep in service. The cyclic temperature operating condition (powercycling) of the solder joint can result in the creep fatigue failure. Thus, a computational technique is used to investigate creep damage in solder joints. The present paper deals with creep damage of leadfree solder joints for powercycling using finite element analysis with the consideration of experimentally observed non-uniform temperature distributions in the 1206 surface mount chip resistor. In addition, a comparison is made for inelastic strain accumulation and fatigue life for creep damage study for spatially uniform and non-uniform temperature powercycling.

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Section: Introductionsupporting

confidence: 54%

“…The geometry used for finite element analysis is the one used in the experiment. The geometric dimensions for both 2D and 3D are similar to those used in [3].…”

Section: Geometry and Materialssupporting

confidence: 49%

Section: Geometry and Materialsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

“…where A = 277984, α = 0.02447, n = 6.41, H/R = 6500. cr   is a steady state-creep strain rate, σ is a stress level, T is absolute temperature [3].…”

Section: Geometry and Materialsmentioning

confidence: 99%

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