Finite element analysis of polysilicon based MEMS temperature-pressure sensor

Samridhi,; Singh, Kulwant; Alvi, P. A.

doi:10.1016/j.matpr.2019.11.024

Cited by 7 publications

(5 citation statements)

References 8 publications

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“…This approach is considered enough for simulating phenomena of interest through finite element analysis (FEA), associated to contact, potential, and dynamics [31]. Moreover, the use FEA tools for MEMS devices such as FSR has been a helpful for plenty of research tasks [32][33][34]. Figure 5 shows four versions of this model, which is very similar to the one shown in Figure 1.…”

Section: Simplified "Four-particle Model" For Finite Element Analysismentioning

confidence: 99%

A Finite Element Analysis Approach to Explain Sensitivity Degradation in Force Sensing Resistors Based on Conductive Polymer Composites

et al. 2022

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Force sensing resistors (FSR) based in conductive polymer composites (CPC) are a cost-effective alternative to load cells for force measurement. Nevertheless, their physical characteristics related to rheological features provoke some drawbacks such as hysteresis, drift, low repeatability, and sensitivity degradation (SD), which is a concerning issue when final application involves periodic loading. Although it is already known that SD is a voltage-related phenomenon and practical considerations to avoid it have been published, a more theoretical approach was yet missing. This study provides a set of finite element analysis (FEA) simplified models to shed light on the situations that favor degradation based in a time-dependent mechanical study considering rheological parameters and how they influence interparticle tunneling conduction. Also, a stationary electrostatic analysis with special scope in contact resistance and its influence in equipotential surfaces arousal. Simulation results show how the effect of contact resistance bends equipotential surfaces favoring conduction through time-increasing interparticle gaps, which is a direct consequence of the low Poisson ratio of considered polymers.

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Section: Simplified "Four-particle Model" For Finite Element Analysismentioning

confidence: 99%

A Finite Element Analysis Approach to Explain Sensitivity Degradation in Force Sensing Resistors Based on Conductive Polymer Composites

et al. 2022

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“…This is 3 to 4 times lower than that found in silicon single crystals [9]. Conventional piezoresistive microsensors utilize one or two active diaphragm resistors and non-pressure-sensitive reference resistors on the wafer [10,11].…”

Section: Introductionmentioning

confidence: 99%

Multiphysics simulation of piezoresistive pressure microsensor using finite element method

Pashmforoush¹

2021

FME Transactions

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In this study, the electro-mechanical behavior of a specially designed highsensitive piezoresistor pressure microsensor was simulated using finite element method, through COMSOL multiphysics software. The mechanical deformation of the diaphragm and the distribution of electrical potential in the piezoresistive were evaluated for various pressure values. In order to determine the influence of the temperature sensitivity parameter, different temperature conditions were investigated. According to the obtained results, by increase of the applied pressure, the resistance of the piezoresistor decreased, while, the sensitivity increased. Also, it was observed that at constant pressure, as the temperature increases, the stress on the diaphragm surface decreases, indicating high stress distribution at the sides and the middle of the diaphragm at low temperatures such as -50 °C. Furthermore, the obtained results demonstrated that temperature variations were not very effective on the potential distribution in the piezoresistor. However, the temperature coefficient of sensitivity demonstrated an increasing tendency with increase of the temperature from -50 °C to 50 °C.

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“…The finite element modeling used in this work is an effective tool for the design and analysis of engineering structures, including strain sensors [ 10 ] and a polysilicon-based temperature pressure sensor [ 11 ]. It was also coupled with the finite volume method for the analysis and design of electrothermal MEMS actuators [ 12 ].…”

Section: Introductionmentioning

confidence: 99%

Modeling and Design Parameter Optimization to Improve the Sensitivity of a Bimorph Polysilicon-Based MEMS Sensor for Helium Detection

Mohaidat,

Alsaleem

2024

Sensors

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Helium is integral in several industries, including nuclear waste management and semiconductors. Thus, developing a sensing method for detecting helium is essential to ensure the proper operation of such facilities. Several approaches can be used for helium detection, including based on the high thermal conductivity of helium, which is several times higher than air. This work utilizes the high thermal conductivity of helium to design and analyze a bimorph MEMS sensor for helium sensing applications. COMSOL Multiphysics software (version 6.2) is used to carry out this investigation. The sensor is constructed from poly-silicon and SiO2 materials with a trenched cantilever beam configuration. The sensor is electrically heated, and its morphed displacement depends on the surrounding gas’s composition, which decreases in the presence of helium. Several factors were investigated to probe their effect on the sensor’s sensitivity to helium, including the thickness of the poly-silicon layer, the configuration of the trench, and the thickness and location of SiO2 layer. The simulations showed that the best performance, up to 2 ppm helium detection level, can be achieved with thinner beams and medium trench lengths.

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Finite element analysis of polysilicon based MEMS temperature-pressure sensor

Cited by 7 publications

References 8 publications

A Finite Element Analysis Approach to Explain Sensitivity Degradation in Force Sensing Resistors Based on Conductive Polymer Composites

A Finite Element Analysis Approach to Explain Sensitivity Degradation in Force Sensing Resistors Based on Conductive Polymer Composites

Multiphysics simulation of piezoresistive pressure microsensor using finite element method

Modeling and Design Parameter Optimization to Improve the Sensitivity of a Bimorph Polysilicon-Based MEMS Sensor for Helium Detection

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