Finite element analysis of the skin effect in current carrying conductors

Chari, M.V.K.; Csendes, Z. J.

doi:10.1109/tmag.1977.1059545

Cited by 56 publications

(23 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Material properties c. Location and quantity of heat generated d. Type and quantity of cooling available By defined the entire information an actual problem can be modeled by reducing it to a mathematical relationship. There are a lot of methods to model this problem and study the heat distribution and dissipation on PCB [13][14][15]. In this research, the chosen method is FEM via Galerkin approach while MATLAB software is used to develop an algorithm and GUI.…”

Section: A Finite Element Methodsmentioning

confidence: 99%

Numerical analysis of heat transfer on PCB current carrying conductor along with an interface

Norhisham

Ismadi

Wani

et al. 2011

2011 IEEE Conference on Open Systems

View full text Add to dashboard Cite

This paper present a numerical one dimensional simulation of heat transfer on printed circuit board (PCB) current carrying conductor. A finite element method via Galerkin approach is applied to obtain the solution of heat transfer problem. A PCB has been designed and then an experiment has been performed for data collection. Analysis from the experiment data has been done and integrated with the simulation part. Both result from simulation and experiment is compared. The simulation result showed that there is a good agreement with the experimental result. It is proven that the algorithm can be applied to the heat transfer analysis of PCB. To show the result interactively, in this research there is a Graphical User Interface (GUI) developed for analysis of heat transfer.

show abstract

Section: A Finite Element Methodsmentioning

confidence: 99%

Numerical analysis of heat transfer on PCB current carrying conductor along with an interface

Norhisham

Ismadi

Wani

et al. 2011

2011 IEEE Conference on Open Systems

View full text Add to dashboard Cite

show abstract

“…To calculate the force generated by the current flowing through the solenoid coil, including any nonlinear effects from the steel and airgap displacement, not amenable to closed form solution, a 2-D axi-symmetric magnetostatic model is created in Maxwell2D (ANSYS, 2016), as shown in Figure 4. Maxwell2D uses the finite element method to calculate the magnetic field (Chari, 1977), as seen in Figure 5, and uses the virtual work method (Fu, 2004) to calculate the force on the moving armature. The winding is shown as a solid object, but it represents 400 turns of copper wire in this model.…”

Section: Electromagneticsmentioning

confidence: 99%

A Simulation-Based Digital Twin for Model-Driven Health Monitoring and Predictive Maintenance of an Automotive Braking System

Magargle¹,

Johnson²,

Mandloi³

et al. 2017

Linköping Electronic Conference Proceedings

View full text Add to dashboard Cite

This paper describes a model-driven approach to support heat monitoring and predictive maintenance of an automotive braking system. This approach includes the creation of a simulation-based digital twin, or numerical model, that combines different modeling formalisms into an integrated model of the braking system that can be used for monitoring, diagnostics, and prognostics. The paper provides an overview of the basic models including Modelica models, reduced order models for various key components of the system model, and controls and sensor models. The Modelica models are implemented in the ANSYS Simplorer simulation to leverage existing modeling work and connections with other ANSYS finite element software to utilize reduced order models. The simulation results include both baseline results for the system and the results of injecting failures into the system for monitoring and predictive maintenance.

show abstract

“…Then, the rate sensitivity m could be determined as a function of test temperature using Eq. (15). m 0 is the initial guess of rate sensitivity used to obtain the current e c , F 1 , n and From the logarithmic plot of log(F 1 Јe -m 0 ) versus log(e -), the rate sensitivity m is determined from the slope and F 1 opt from the intercept.…”

Section: Inverse Analysis Of Hot Compression For Obtaining Coefficienmentioning

confidence: 99%

Regression Method of Determining Generalized Description of Flow Curve of Steel under Dynamic Recrystallization

Yanagida

2005

ISIJ Int.

View full text Add to dashboard Cite

A regression method of obtaining a generalized description of a flow curve is proposed in this paper. The flow curve of a metal at a constant temperature and a constant strain rate is precisely obtained by an inverse analysis of hot compression. To eliminate the error in the flow curve induced by the inhomogeneous distribution of temperature in the test piece, an electromagnetic analysis of induction heating is performed with thermal analysis throughout the heating and hot compression of a test piece. The coefficients embedded in the flow curve are determined by the inverse analysis associated with thermomechanical FE (Finite Element) analysis. The obtained coefficients, which cover wide ranges of hot-forming temperature and high strain rate, are regressed using the proposed regression method, and a generalized flow curve for a C-Si-Mn steel is obtained. Although the proposed regression method is demonstrated for only one type of C-Si-Mn steel, it could also be used to obtain a generalized description of a flow curve for other types of steel under dynamic recrystallization, which could be used to estimate the force characteristics of hot metals in bulk forming processes, such as forging and rolling.KEY WORDS: generalized flow curve; hot compression test; regression; inverse analysis; dynamic recrystallization.analysis of hot compression is implemented in the inverse analysis of the flow curve using the measured change in the compression force versus stroke curve. Previously, 14) the empirical relationship was applied to estimate the internal heat generation induced by induction heating, which may have resulted in the error in the flow curve obtained by the inverse analysis. Also, this empirical relationship could not be applied to induction heating during upsetting in a hot compression test.As the present investigation is aimed at presenting a generalized description of a flow curve, which could be used in the development of forming technologies, we should reduce the error in the flow curve as much as possible. Then, a new electromagnetic analysis of induction heating for estimating the nonuniform generation of internal heat is developed, which is coupled with the thermomechanical analysis of hot compression. Electromagnetic Analysis of Induction HeatingThe magnetic field induced by electric current is governed by Eqs. (1) and (2) for generalized three-dimensional problems. Here, J 0 and J e are the magnetizing current density and eddy current density, respectively. n n, Q, L L and f are the reluctivity, electric conductivity, magnetic vector potential and electric scalar potential, respectively.The cylindrical specimen is used as the test piece in this research (Fig. 1). The spiral geometry of the coil that surrounds the test piece may require a three-dimensional solution of the electromagnetic field, but we could assume that the internal heat generation induced by the electromagnetic field will exhibit rather uniform distributions in the circumferential direction, because a cylindrical specimen is used in the ...

show abstract

Finite element analysis of the skin effect in current carrying conductors

Cited by 56 publications

References 1 publication

Numerical analysis of heat transfer on PCB current carrying conductor along with an interface

Numerical analysis of heat transfer on PCB current carrying conductor along with an interface

A Simulation-Based Digital Twin for Model-Driven Health Monitoring and Predictive Maintenance of an Automotive Braking System

Regression Method of Determining Generalized Description of Flow Curve of Steel under Dynamic Recrystallization

Contact Info

Product

Resources

About