Finite-element analysis of thermal stresses in the single-mode bonded splice

Abstract

Extremely low-loss single-mode optical fiber splices made with an AT&T bonded design permit longer unrepeatered spans. Average losses of less than 0.05 dB have been achieved in the field by ordinary cable splicers. The splices were designed for stability over a wide range of temperatures using finite-element analysis techniques. This analysis permitted optimization of the splice geometry and material selection for performance over a temperature range of -40 to 77 degrees C. Environmental testing demonstrates that the design performs as predicted when cycled over this extreme temperature range, with no added loss incurred after any testing. This combination of design analysis and thorough environmental testing ensures the reliability of the single-mode bonded splice.