Finite Element Based Point Stress Criterion for Predicting the Notched Strengths of Composite Plates

Tsai, K.-H.; Hwan, Chung‐Li; Lin, Meng Ju; Huang, Yi‐Chin

doi:10.1017/jmech.2012.48

Cited by 16 publications

(17 citation statements)

References 24 publications

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“…Hence, WLUF was rich at the peripheral margin of the gap between the first chip and the Si substrate, as well as among the stacked chips. Figure 6 provides an enlarged view of the μ-bumps after chip stacking in both FEA [ 24 , 25 ] and the actual specimen. Figure 7 exhibits the detailed dimensions, components, and finite element mesh of the μ-bump framework used in the temperature cycling simulation.…”

Section: Failure Analysis and The Estimation Of Fatigue Lifetime Imentioning

confidence: 99%

Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests

Lee

2017

Materials

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The microbump (μ-bump) reliability of 3D integrated circuit (3D-IC) packaging must be enhanced, in consideration of the multi-chip assembly, during temperature cycling tests (TCT). This research proposes vehicle fabrications, experimental implements, and a nonlinear finite element analysis to systematically investigate the assembled packaging architecture that stacks four thin chips through the wafer level underfill (WLUF) process. The assembly of μ-bump interconnects by daisy chain design shows good quality. Results of both TCT data and the simulation indicate that μ-bumps with residual SnAg solders can reach more than 1200 fatigue life cycles. Moreover, several important design factors in the present 3D-IC package influence μ-bump reliability. Analytical results show that the μ-bump’s thermo-mechanical reliability can be improved by setting proper chip thickness, along with a WLUF that has a low elastic modulus and a small coefficient of thermal expansion.

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Section: Failure Analysis and The Estimation Of Fatigue Lifetime Imentioning

confidence: 99%

Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests

Lee

2017

Materials

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“…Giare and Shabahang (1989) used a finite-element analysis to calculate the stress distribution around a hole in a finite isotropic plate reinforced by composite material. Tsai et al (2012) developed a novel procedure for predicting the notched strengths of composite plates with a circular hole, where the stress distribution of the circular cut-out is obtained by a finite-element analysis.…”

Section: Introductionmentioning

confidence: 99%

A dimensionless analysis of shear modulus and stress distribution for anisotropic materials

Yeh

2016

Journal of Marine Engineering & Technology

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The effect of various offaxis angles and lamina material properties on the shear modulus and the stress distribution of a circular cutout in an orthotropic composite plate under shear loadings are presented. Based on the generalized Hooke's law, the generalized plane stress condition and the complex variable method, a dimensionless analysis is used to evaluate the influence of various elastic moduli E 1 , E 2 , G 12 and ν 12 on the laminate shear modulus and the stress distribution along the boundary of the circular cutout within the laminate under shear loading. The results obtained from this dimensionless analysis provide a set of general design guidelines for structural laminates with high-precision requirements in engineering applications.

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“…Design parameters include the wire arrangement position, wire number, wire bonding perimeter and wire height are studied, and the design trend of aluminum wire is examined as well. Furthermore, FE analysis can assess the design trend [9,10] of interconnection efficiently and significantly reduce the development time of a high power module. Figure 1 shows the power module developed by the Industrial Technology Research Institute (Hsinchu, Taiwan).…”

Section: Introductionmentioning

confidence: 99%

Study on configuration design of interconnection in high power module

Liao

Hung

Liu

et al. 2014

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and

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In a high power module, a high electrical load may cause electromigration and induce the joule heating, subsequently raising the chip temperature. Temperature excursion in the IGBT chip may produce thermal stress, inducing failure in the metal wire and chip. Those failure modes degrade the reliability of a power module. This study elucidates the coupling behavior of a high power module through electro-thermal coupling analysis and thermo-mechanical analysis.Additionally, the configuration design of an aluminum wire is simulated and implemented. Related design parameters, e.g., wire arrangement position, wire number, wire bonding perimeter and wire height, are studied and the design trend of a metal wire is analysed and suggested as well.

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Finite Element Based Point Stress Criterion for Predicting the Notched Strengths of Composite Plates

Cited by 16 publications

References 24 publications

Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests

Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests

A dimensionless analysis of shear modulus and stress distribution for anisotropic materials

Study on configuration design of interconnection in high power module

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