Finite Element Method for System-in-Package (SiP) Technology: Thermal Analysis Using Chip Cooling Laminate Chip (CCLC)

Oukaira, Aziz; Said, Dhaou; Zbitou, Jamal; Lakhssassi, Ahmed

doi:10.1109/imcom56909.2023.10035652

Cited by 8 publications

(1 citation statement)

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“…However, the primary challenge today is not about how many transistors can be incorporated on a single chip; instead, it is about how to integrate a wide range of diverse technologies in a predictable and cost-effective manner. This is where System-in-Package (SiP), an extension of the System-on-Chip (SoC) concept, offers a solution by overcoming significant integration obstacles while allowing for optimization of individual chip technologies [3][4][5]. By preserving the on-chip electrical environment, SiP offers better performance with lower cost compared to SoC.…”

Section: Introductionmentioning

confidence: 99%

Advanced Thermal Control Using Chip Cooling Laminate Chip (CCLC) with Finite Element Method for System-in-Package (SiP) Technology

et al. 2023

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This paper introduces a novel approach to address thermal management challenges in system-in-package (SiP) technology, which is a significant concern in various advanced technologies. The main objective is to assess the electrical and thermal performance of the SiP model by utilizing Chip Cooling Laminate Chip (CCLC) technology. To achieve this, we employed finite element method (FEM) analysis using COMSOL Multiphysics® and MATLAB® to compare the results of electrical and thermal SiP models with and without CCLC technology. The numerical simulations revealed that, as opposed to the traditional model, the temperature variation decreased significantly with a uniform temperature distribution when employing the CCLC technology. Additionally, the thermal conduction performance of the packaging system using CCLC demonstrated remarkable reliability and resolution with cost-effective micro-devices, particularly in micro-medicine applications. The analysis of the electrical and thermal models reported a maximum error between them of 1.15 ∘C.

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Section: Introductionmentioning

confidence: 99%