Finite element modeling of BGA packages for life prediction

Gustafsson, G.; Guven, Ibrahim; Kradinov, Vladimir; Madenci, Erdogan

doi:10.1109/ectc.2000.853300

Cited by 49 publications

(10 citation statements)

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“…With the advances in computer technology and further sophistication of FEA software, it is likely that a detailed non-linear 3D finite element modeling approach can be employed in a more computational efficiency manner than previous modeling approaches which required some modeling assumptions for model size reduction [10,[12][13]. Nevertheless, mesh generation for a part containing complex geometries or fine features in adjacent regions could still be a challenging and tedious task that may somehow require the geometrical simplification or skillful meshing technique for a quality mesh.…”

Section: Surface-based Tie Constraint Techniquementioning

confidence: 99%

A finite element analysis of board level temperature cycling reliability of embedded wafer level BGA (eWLB) package

Chow

Lin

Ouyang

et al. 2012

2012 IEEE 62nd Electronic Components and Technology Conference

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Three dimensional finite element analysis (FEA) is performed to assess the board level temperature cycling reliability for lead-free solder Sn96.5Ag3Cu0.5 (SAC305) used in eWLB packages. With Anand viscoplastic constitutive model used for the solder material, the chosen damage parameters, i.e. accumulated creep strain or accumulated creep strain energy density, can be derived from the finite element analysis (FEA) models and then can be correlated with the solder fatigue life obtained from the temperature cycling tests.In this study, a surface-based tie constraint technique is employed in the FEA models to facilitate mesh transition requirements at various interfaces of incompatible meshes. It is particularly the case arising from the die edges overlie the circular solder pads in the models. To deal with such situations, the FEA model for the entire package-to-board assembly can be strategically split into two parts and then connected to each other with tie constraints for the ease of meshing effort. It is found that this technique can help in managing a more uniform mesh distribution over the regions of interest, such as solder joints and dielectric layers with refine meshes, and yet allow a relatively coarse mesh to be assigned elsewhere for model size reduction. Thus, the computational efficiency for these tie-constraint models can be improved significantly as compared with their corresponding single part models with fine meshes and yet the model accuracy for the critical solder joint fatigue life estimation can be preserved. A model validation and numerical case study will be provided to illustrate the application of this modeling technique.

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Section: Surface-based Tie Constraint Techniquementioning

confidence: 99%

A finite element analysis of board level temperature cycling reliability of embedded wafer level BGA (eWLB) package

Chow

Lin

Ouyang

et al. 2012

2012 IEEE 62nd Electronic Components and Technology Conference

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“…In order to reduce the element size in the FE simulation, the modified models such as slice or strip model [1], [2], one-eighth or octant model [2]- [6], 2-D models [2], [5]- [7] containing 2-D plane strain, 2-D plane stress, and axisymmetric model have been used by researchers with some tradeoff in accuracy. Submodeling technique, also called global-local modeling, has been widely used in the FE simulation for electronic assemblies to reduce the computer time and resource required without a loss of accuracy [8]- [10]. In this paper, the FE simulation results were compared among the different FE models.…”

Section: Introductionmentioning

confidence: 99%

Fatigue Reliability Analysis of Sn–Ag–Cu Solder Joints Subject to Thermal Cycling

Pang

2013

IEEE Trans. Device Mater. Relib.

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In this paper, thermal cycling tests and finiteelement analysis (FEA) for a plastic ball grid array package with Sn-3.8Ag-0.7Cu lead-free solder joints have been performed. The solder joint fatigue lives were predicted and compared by using different 2-D and 3-D FEA models. The effects of solder constitutive models and fatigue life models on solder fatigue life prediction have been investigated. In order to obtain fatigue parameters, new averaging volumes were proposed for the solder fatigue life prediction. Different reference temperatures were simulated to investigate its effect on the solder fatigue life prediction. The effect of intermetallic compound thickness on solder joint fatigue life prediction was also investigated. Index Terms-Fatigue reliability, finite-element (FE) modeling, lead-free solder, life prediction, thermal cycling (TC).

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“…Many commercial companies are increasingly interested in the response of electronic components subjected to drop impacts because impact loads are the main cause of mechanical failures in products [1]- [15]. The evolving trend is to supplement drop and shock testing of products and components with computational simulation using commercial finite element (FE) analysis [1]- [9].…”

Section: Introductionmentioning

confidence: 99%

Finite element modeling of electronic packages subjected to drop impact

Tan

Tong

Lim

et al. 2005

IEEE Trans. Comp. Packag. Technol.

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As more electronic products become portable, many product manufacturers have started to pay more attention to the robustness of their products. Finite element (FE) simulation has become increasingly popular in the analysis of products subjected to impact loading. The need for details in a FE mesh is always balanced by considerations of simulation time and available computational resources. In this paper, three commonly used approaches to FE modeling of a ball grid array (BGA) package subjected to drop impact are evaluated. The first model comprises a detailed mesh of the printed circuit board (PCB), integrated circuit (IC) package and interconnecting solder balls using solid three-dimensional (3-D) elements. The degrees of freedom is reduced for the second mesh by using shell elements for the PCB and IC package while retaining the detailed mesh of the solder balls using solid 3-D elements. The third mesh is a further simplification of the second mesh whereby the solder balls are replaced by a single beam element each. The stresses within the solder balls are then obtained in a separate FE analysis of a detailed solder ball mesh using the displacement history of nodes around the beam elements from the previous analysis as inputs. Solder ball stresses from all three meshes were found to differ by as much as 40% although PCB deflection compared favorably.Index Terms-Ball grid array (BGA), drop impact, finite element (FE) simulation.

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Finite element modeling of BGA packages for life prediction

Cited by 49 publications

References 0 publications

A finite element analysis of board level temperature cycling reliability of embedded wafer level BGA (eWLB) package

A finite element analysis of board level temperature cycling reliability of embedded wafer level BGA (eWLB) package

Fatigue Reliability Analysis of Sn–Ag–Cu Solder Joints Subject to Thermal Cycling

Finite element modeling of electronic packages subjected to drop impact

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