Finite element modelling and experimental investigation on effective thermal conductivity of AlN (nano) particles reinforced HDPE polymer nanocomposites

Rajeshwari, P.; Dey, T.K.

doi:10.1016/j.tca.2016.06.016

Cited by 18 publications

(12 citation statements)

References 69 publications

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“…where, K 1 , K 2 , and K denote thermal conductivity of the matrix (continuous phase), filler (dispersed phase), and composites, respectively, and V f denotes filler volume fraction. Maxwell‐Eucken model …”

Section: Some Thermal Conductivity Modelsmentioning

confidence: 99%

“…Because mutual interaction between the particles is very low in Maxwell‐ Eucken's model, and there is some deviation between experimental “K” and Maxwell‐Eucken's model at high V f . Bruggeman's model …”

Section: Some Thermal Conductivity Modelsmentioning

confidence: 99%

“…• Maxwell-Eucken model 48,49 Primarily, this model has been derived by James Clerk Maxwell to predict electrical conductivity of the heterogeneous media. Later during the 1940s, A. Eucken proposed it for predicting "K" of polymer composites which are reinforced with loosely held, randomly dispersed spherical fillers.…”

Section: Effect Of the Filler Concentrationmentioning

confidence: 99%

“…• Bruggeman's model 48 Mathematical expression proposed by Bruggeman is used to estimate effective "K" of heterogeneous materials. Compared to other models, Bruggeman model is the more accurate for high V f .…”

Section: Effect Of the Filler Concentrationmentioning

confidence: 99%

“…• Nielsen and Lewis model [48] Halpin (1969)-Tsai (1968) model is a more familiar theory to determine elastic moduli of all types of composite materials. This empirical formula is the modified form of Halpin-Tsai model, which considers many influencing factors.…”

Section: Effect Of the Filler Concentrationmentioning

confidence: 99%

See 4 more Smart Citations

Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

Balasubramanian

Ramesh²

2018

Polymers for Advanced Techs

153

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Ever since the discovery of polymer composites, its potential has been anticipated for numerous applications in various fields such as microelectronics, automobiles, and industrial applications. In this paper, we review filler reinforced polymer composites for its enormous potential in microelectronic applications. The interface and compatibility between matrix and filler have a significant role in property alteration of a polymer nanocomposites. Ceramic reinforced polymeric nanocomposites are promising candidate dielectric materials for several micro‐ and nano‐electronic devices. Because of its synergistic effect like high thermal conductivity, low thermal expansion, and dielectric constant of ceramic fillers with the polymer matrix, the resultant nanocomposites have high dielectric breakdown strength. The thermal and dielectric properties are discussed in the view of filler alignment techniques and its effect on the composites. Furthermore, the effect of various surface modified filler materials in polymer matrix, concepts of network forming using filler, and benefits of filler alignment are also discussed in this work. As a whole, this review article addresses the overall view to novice researchers on various properties such as thermal and dielectric properties of polymer matrix composites and direction for future research to be carried out.

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Section: Some Thermal Conductivity Modelsmentioning

confidence: 99%

Section: Some Thermal Conductivity Modelsmentioning

confidence: 99%

Section: Effect Of the Filler Concentrationmentioning

confidence: 99%

Section: Effect Of the Filler Concentrationmentioning

confidence: 99%

Section: Effect Of the Filler Concentrationmentioning

confidence: 99%

See 3 more Smart Citations

Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

Balasubramanian

Ramesh²

2018

Polymers for Advanced Techs

153

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Improvements in thermal conductivity and mechanical properties of HDPE/nano‐SiC composites by the synergetic effect of extensional deformation and ISBS

Yin

Yang

Cheng

et al. 2019

J of Applied Polymer Sci

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A new melt blending method under synergy of extensional deformation and in-situ bubble stretching for high-density polyethylene (HDPE) thermally conductive composites filled by nano silicon carbide (nano-SiC) was reported. Effects of loadings and mixing time of azodicarbonamide (AC) foaming agent on the properties of the composites were experimentally studied. Scanning electron microscopy imaging showed that the nano-SiC particles dispersed uniformly in the HDPE matrix with the addition of AC. The complex viscosity and storage modulus increased with increasing AC content and decreased with increasing mixing time. The mechanical properties of the composites improved with the addition of AC and proper mixing times. The thermal conductivity of the composites increased from 0.2 to 0.7 W m −1 K −1 without any damage to the mechanical properties when the mixing time increased from 2 to 6 min. These results showed that the new mixing technique enables us to prepare particle-filled thermally conductive polymer composites.

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Depth‐sensing indentation and nano‐dynamic mechanical properties of aluminum nitride nanoparticles reinforced high density poly‐ethylene nanocomposites

2017

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Inorganic aluminum nitride (AlN) nanoparticles offer numerous innovative applications in the field of electronic packaging due to its outstanding features; viz., high mechanical strength, stable crystal structure, excellent thermal conductivity, low coefficient of thermal expansion, low-cost, and non-toxicity. In this research, attempts have been made to investigate the effect of reinforcement of nano-AlN particles in high density poly-ethylene (HDPE) thermoplastic polymer on their nano-mechanical properties using depth-sensing indentation (DSI) technique. Polymer-matrix nanocomposites composed of pure HDPE and 1-20 vol% nano-AlN/HDPE composites are prepared via melt mixing followed by compression molding. Surface-morphology and crystallinity of HDPE/nano-AlN composites are characterized by scanning electron microscopy (SEM), atomic force microscopy (AFM), and differential scanning calorimetry (DSC). Nano-scale hardness, modulus of elasticity, storage modulus, and loss tangent (tand) of HDPE/nano-AlN composites have been evaluated using static and dynamic-DSI. Both static and dynamic-DSI results indicate that with increasing concentration of AlN nanoparticles in pristine HDPE, the nanomechanical properties display significant improvement. Results are discussed in relation to the surfacemorphology, crystallinity and interfacial adhesion between pure HDPE and nano-AlN particles. A comparison between nano-mechanical data extracted from static-DSI and dynamic-DSI techniques analysis is also attempted. POLYM. COMPOS., 00:000-000, 2017.

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Finite element modelling and experimental investigation on effective thermal conductivity of AlN (nano) particles reinforced HDPE polymer nanocomposites

Cited by 18 publications

References 69 publications

Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

Improvements in thermal conductivity and mechanical properties of HDPE/nano‐SiC composites by the synergetic effect of extensional deformation and ISBS

Depth‐sensing indentation and nano‐dynamic mechanical properties of aluminum nitride nanoparticles reinforced high density poly‐ethylene nanocomposites

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