2010
DOI: 10.1007/s00170-010-2610-x
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Finite element simulation and experimental study on the through-mask electrochemical micromachining (EMM) process

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Cited by 27 publications
(3 citation statements)
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“…For non-uniform electrochemical machining, the electric field was weak and there was no strong convective mass transfer effect. The transport of particles mainly depended on diffusion, so the polarization effect and concentration gradient could not be ignored [30,31]. Microscopic simulations, such as molecular dynamics, can describe the dissolution phenomenon at the atomic or electronic level; however, for tens of micrometer-scale pores, the current calculation level cannot meet the requirement.…”
Section: Introductionmentioning
confidence: 99%
“…For non-uniform electrochemical machining, the electric field was weak and there was no strong convective mass transfer effect. The transport of particles mainly depended on diffusion, so the polarization effect and concentration gradient could not be ignored [30,31]. Microscopic simulations, such as molecular dynamics, can describe the dissolution phenomenon at the atomic or electronic level; however, for tens of micrometer-scale pores, the current calculation level cannot meet the requirement.…”
Section: Introductionmentioning
confidence: 99%
“…In this method, lithography is utilized to fabricate the patterned samples on non-planner surfaces, which is costly process for fabrication of many patterned samples. Effects of structured electrode is investigated on surface patterning by TMEMM method mathematically and experimentally using 10 wt.% NaCl + 10 wt.% NaNO 3 electrolyte [3]. TMEMM is utilized to fabricate well-defined surface textures using 3 M sulfuric acid.…”
Section: Introductionmentioning
confidence: 99%
“…Electrochemical micromachining (EMM) involves shaping materials on the micrometer to submicrometer scale by performing electrochemistry, conventionally through small openings in an insulating mask. , The benefits of EMM include exceptional control of etching rate and extent, as well as an ability to smoothly shape conductive materials of any hardness and domain size without incurring wear. However, EMM has traditionally been limited to the removal of material, restricting the technique to precision milling. We have recently reported an EMM method designated RIPPLE (reactive interface patterning promoted by lithographic electrochemistry), which entails electrochemically patterning thin films of metal ( e.g.…”
mentioning
confidence: 99%