Finite Element Simulation of Backward Micro Extrusion for Annealed Copper

Abstract

The growing demand of miniaturized products is tremendously influencing the progress of micro-forming technologies. The implementations of micro technologies in the field of microelectronics, sensors, and medical equipment necessitate versatile micro-forming processes. These processes facilitate the bulk production of micro parts with higher precision, minimum material waste, and better surface finish. However, micro-forming technologies are still expensive due to the limitations of traditional materials and stringent size requirements. Finite element simulations are being widely used to analyze the manufacturing process parameters before going into production. In this research, a backward micro-extrusion process is simulated for annealed copper by using commercial Finite element simulation software. The effects of different punch diameters, friction coefficients, punch velocities on the load-displacement curves and the resulting strain distributions are investigated. To overcome limitations of the post-yield hardening data from the uniaxial compression test, the Ramberg-Osgood model is proposed to predict the responses at the higher plastic strain.

Cu Pumping Analysis during Cu/SiO2 Hybrid Bonding using In-situ SPM Imaging

“…Temperature variations in Young's modulus of Cu, as well as the coefficients of thermal expansion of SiO2, Cu, Si and Ti, were also taken into consideration. The nonlinear stress-strain relationship of the Cu was implemented in the simulation by using the Ramberg-Osgood model [12,13]. Here ∆h was defined as the average height difference of Cu in the middle of the pad to the SiO 2 .…”

3D Integration via D2D Bump-Less Cu Bonding with Protruded and Recessed Topographies

“…The nonlinear stress-strain relationship of the Cu was implemented in the simulation by using the Ramberg-Osgood model. 19,20 The bond shear strength of the samples was also evaluated by using a shear tester (Optima 4000 plus, Nordson Dage) at a speed of 30 μm s −1 at room temperature.…”