Finite element simulation of microindentation

Zhuk, D. I.; Isaenkova, Margarita; Perlovich, Yuriy; Krymskaya, Olga

doi:10.1134/s0036029517050123

Cited by 16 publications

(7 citation statements)

References 8 publications

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“…By performing FE simulations, the predictions based on the three-dimensional Berkovich model are in general accordance with those by using the two-dimensional equivalent model as found by Zhuk et al [32]. Essentially, the standard Berkovich indenter enables the consistency in terms of projected area by equivalent sharp indenters (e.g., conical, triangular pyramidal and square-based pyramidal indenters) for the indentations [33,34].…”

Section: Validation With No-film Modelsupporting

confidence: 77%

“…A wide range of film materials is elastoplastic materials with the film thickness of 10-30 µm and the mechanical properties for Young's modulus of 10-50 GPa, yield strength of 60-300 MPa, hardening exponent of 0.1-0.5, and Poisson's ratio of 0.07. As shown in Figure 3, the solid line indicates the FE simulations and the spheres represent the experimental measurements [34], both of which are in good agreement, confirming the accuracy of the FE models when predicting the indentation response.…”

Section: Validation With No-film Modelsupporting

confidence: 66%

“…the consistency in terms of projected area by equivalent sharp indenters (e.g., conical angular pyramidal and square-based pyramidal indenters) for the indentations [33,34 Figure 2 shows the schematic diagram of the FE model for indention simulation w a film/substrate structure by using a Berkovich indenter. The film is attached on top o substrate by assuming a perfect interfacial adhesion.…”

Section: Validation With No-film Modelmentioning

confidence: 99%

“…For validating the established FE models for simulating indentation response, a series of comparisons is made for the FE predictions with the reported experimental results in the literature. First, considering a simpler indentation condition without the composition of film and substrate in the FE model, the predicted P-h curves are compared with the experimental results [34]. Table 1 lists the mechanical properties for both elastic Berkovich indenter and elastoplastic substrate.…”

Section: Validation With No-film Modelmentioning

confidence: 99%

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Dimensionless Analysis to Determine Elastoplastic Properties of Thin Films by Indentation

Long

Shen

et al. 2022

Coatings

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By assuming the elastoplastic properties of thin-film materials, a reverse analysis method is proposed by deriving a dimensionless function for the indentation process. The substrate effect is taken into account by assuming a perfect interface between thin-film and substrate materials. In order to obtain the applied load–penetration depth (P-h) curves, the indentation process is numerically modeled as an axisymmetric problem with a rigid-body Berkovich indenter on the semi-infinite substrate when performing finite element (FE) simulations. As a typical soft film/hard substrate problem, the elastic substrate is assumed and the power–law model is used to describe the constitutive properties of thin-film materials. Varying elastic modulus (10–50 GPa), yield strength (60–300 MPa), and hardening exponent (0.1–0.5) characterize different elastoplastic mechanical properties of thin-film materials with film thickness of 10–30 μm. Owing to the good trending P-h curves with the maximum indentation depth up to the 2/3 film thickness for different elastoplastic thin-film materials, a dimensionless function is derived and validated based on the predictions by reliable FE simulations. The proposed dimensionless function elegantly elucidates the essential relationship between the elastoplastic mechanical properties of the thin-film material and indentation responses (e.g., loading and unloading variables). The elastoplastic constitutive curves predicted by the proposed reverse method are confirmed to be in good agreement with the stress-strain curves of materials by FE simulations with the randomly selected elastoplastic mechanical properties and film thicknesses. This study provides a theoretical guidance to understand the explicit relationship between elastoplastic mechanical properties of the thin-film material and indentation responses.

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Section: Validation With No-film Modelsupporting

confidence: 77%

Section: Validation With No-film Modelsupporting

confidence: 66%

Section: Validation With No-film Modelmentioning

confidence: 99%

Section: Validation With No-film Modelmentioning

confidence: 99%

See 2 more Smart Citations

Dimensionless Analysis to Determine Elastoplastic Properties of Thin Films by Indentation

Long

Shen

et al. 2022

Coatings

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show abstract

“…The nodes on the left boundary were constrained in the X-direction and those at the bottom were restrained in the Y-direction. A rigid conical indenter with angles of 65.3 • and 70.3 • was established, in which the indenter with angles of 65.3 • and 70.3 • was equivalent to the Berkovich and Vickers indenter, respectively [34,41,42]. The indentation depth ranged from 0.01 mm to 1 mm with an interval of 0.01 mm.…”

Section: Finite Element Modelmentioning

confidence: 99%

An indentation method for determining the film thickness, Young’s modulus, and hardness of bilayer materials

Zhao¹,

Zhang²,

Liu³

et al. 2022

J. Phys. D: Appl. Phys.

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Simultaneously determining the film thickness, Young’s modulus and hardness of film and substrate is a significant challenge due to the substrate effect. A method to solve the inverse problem of characterizing the mechanical properties of bilayer materials for instrumented indentation testing is proposed. This is done in combination with a weight function which could be obtained via finite element simulation. Using the proposed method, the film thickness and Young’s modulus of film-substrate materials, and the hardness values of the film and substrate could be determined. The proposed method is applicable to Vickers, Berkovich, and 70.3° conical indenters. Within the study range, numerical and theoretical results show that this method is both feasible and accurate in determining the above parameters, compared with existing experimental results. The method flow chart to determine the above parameters is also shown. This method separates the coupling effect between the film and the substrate in the bilayer material, giving it practical prospects in the field of indentation testing technology.

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Identification of Mechanical Properties of Thin-Film Elastoplastic Materials by Machine Learning

Long

Shen

et al. 2022

Acta Mech. Solida Sin.

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Finite element simulation of microindentation

Cited by 16 publications

References 8 publications

Dimensionless Analysis to Determine Elastoplastic Properties of Thin Films by Indentation

Dimensionless Analysis to Determine Elastoplastic Properties of Thin Films by Indentation

An indentation method for determining the film thickness, Young’s modulus, and hardness of bilayer materials

Identification of Mechanical Properties of Thin-Film Elastoplastic Materials by Machine Learning

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