Finite volume modelling of stencil printing process

Krammer, Olivér

doi:10.1109/siitme.2014.6966998

Cited by 9 publications

(6 citation statements)

References 12 publications

(12 reference statements)

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“…It was found that the through-holes were filled almost linearly over time (Figure 13). However, the pressure on the solder paste increases exponentially as the squeegee travels over the through-hole [10,11]. The amount of solder paste also gradually increases in the hole, introducing resistance against the filling and resulting in almost linear fill-dynamics.…”

Section: Resultsmentioning

confidence: 99%

“…Bailey et al created a 2D numerical model to identify optimal stencil printing parameters for flip-chip assembly [9]. A similar finite volume model was created by Krammer for the stencil printing process to investigate the flow of the solder paste and the pressure distribution along the stencil during the printing [10]. Krammer et al and Durairaj et al also analyzed the differences between using Newtonian and non-Newtonian fluid properties.…”

Section: Introductionmentioning

confidence: 99%

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Transient Numerical Modelling of the Pin-in-Paste Technology

2021

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The pin-in-paste technology is an advancing soldering technology for assembling complex electronic products, which include both surface-mounted and through-hole components. A computational fluid dynamics model was established to investigate the stencil printing step of this technology, where the hole-filling by the solder pastes is the most critical factor for acquiring reliable solder joints. The geometry of the transient numeric model included the printing squeegee, the stencil, and the through-holes of a printed circuit board with different geometries and arrangements. A two-phase fluid model (solder paste + air) was applied, utilizing the Volume of Fluid method (VoF). The rheological properties of the solder paste were addressed by an exhaustive viscosity model. It was found that the set of through-holes affected the flow-field and yielded a decrease in the hole-filling if they were arranged in parallel with the travelling direction of the printing squeegee. Similar disturbance on the flow-field was found for oblong-shaped through-holes if they were arranged in parallel with the squeegee movement. The findings imply that the arrangement of a set of through-holes and the orientation of oblong-shaped through-holes should be optimized even in the early design phase of electronic products and during the set of assembly processes. The soldering failures in pin-in-paste technology can be reduced by these early design-phase considerations, and the first-pass yield of electronic soldering technologies can be enhanced.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Transient Numerical Modelling of the Pin-in-Paste Technology

2021

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“…After making the move to lead-free solder paste and soldering reduction in pad and component, the defects observed were much more substantial than they had been previously [4]. There have been a few different attempts made to experiment with stencil printing [5,6,7], and overall expenditures of creating and testing stencil printing systems experimentally often include both monetary and time commitments.…”

Section: Introductionmentioning

confidence: 99%

Numerical Study on the Effect of Different Viscometer Test on Stencil Printing Process

Ishak,

Rusdi,

Abdullah

et al. 2022

Jurnal Teknologi

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Using CFD simulation, this study analyses the applicability of several spindle types for assessing lead-free solder paste. The purpose of this investigation is to determine how much solder paste applied on the solder pad. Five separate studies were conducted on parallel-plate (PP) and cone-plate (CP) spindles. The simulation was performed by using the Volume of Fluid (VOF) approach, and the Cross model represented solder paste viscosity. Since it is popularly used in modern industry, lead-free solder paste SAC305 type 3 was chosen for this study. Regardless of squeegee speed or aperture size, solder paste always filled the volume. The PP with 0.5 mm gap exhibits the smallest average disparity between simulation and experiment for all squeegee speeds tested. For 1⁰ CP, all experiments show similar trend line with average disparity except for 0.5 mm PP. All tests with very small aperture volumes produced comparable filled volume values, except for 0.5 mm PP test, which showed the smallest percentage change when the experimental data is compared at higher aperture volumes. This method can be used by other simulation researchers to get solder paste’s viscosity data for their solder paste simulation.

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“…Krammer [2] used the Finite Volume Method (FVM) to compare the simulation of stencil printing between non-Newtonian model and Newtonian model for solder paste. From the research made, it was concluded that the solder paste must be simulated by using a non-Newtonian model.…”

Section: Introductionmentioning

confidence: 99%

Effects of Different Viscometer Test on Stencil Printing Process for CFD Simulation

Ishak

Rusdi

Abdullah

et al. 2021

Preprint

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This study discusses the use of different spindle type for the testing of lead-free solder paste by using Computational Fluid Dynamics (CFD) simulation. The study focuses on measuring the volume of solder paste deposition on the solder pad. Parallel-plate (PP) and Cone-plate (CP) spindle were used with five different tests consist of different spindle type and setting. The Volume of Fluid (VOF) method was used for the simulation while Cross model was applied as viscosity model for the solder paste. SAC305 type 3 lead-free solder paste was used in this study as it is mostly popular used by the industries nowadays. The solder paste filled the volume under different squeegee speeds and aperture size was compared between experiments and simulations. For different squeegee speed, PP 0.5 mm gap obtained the lowest average discrepancy value between simulation and experimental results. At different aperture size, all test show similar trend line and about the same value of average discrepancy with CP1° while PP 0.5 mm gap showed the lowest average discrepancy. At small aperture volume, all tests performed shows similar value of filled volume except PP 0.5 mm which exhibit the lowest percentage difference when compared with the experimental values at a bigger aperture volume.

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Finite volume modelling of stencil printing process

Cited by 9 publications

References 12 publications

Transient Numerical Modelling of the Pin-in-Paste Technology

Transient Numerical Modelling of the Pin-in-Paste Technology

Numerical Study on the Effect of Different Viscometer Test on Stencil Printing Process

Effects of Different Viscometer Test on Stencil Printing Process for CFD Simulation

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