2023
DOI: 10.1016/j.fusengdes.2023.113529
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First characterization of the SPIDER beam AC component with the Beamlet Current Monitor

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Cited by 4 publications
(4 citation statements)
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“…The first feature perm The BCMs were used to perform an in-depth characterization of the AC component of the SPIDER beam during the first campaign with cesium evaporation. Recurring oscillations were found, their amplitudes were measured and compared to the DC values of the beamlet currents and the frequencies were correlated with those of the RF oscillators and other power supplies when possible [35].…”
Section: Discussionmentioning
confidence: 99%
“…The first feature perm The BCMs were used to perform an in-depth characterization of the AC component of the SPIDER beam during the first campaign with cesium evaporation. Recurring oscillations were found, their amplitudes were measured and compared to the DC values of the beamlet currents and the frequencies were correlated with those of the RF oscillators and other power supplies when possible [35].…”
Section: Discussionmentioning
confidence: 99%
“…aperture and uses a combination of fluxgate (DC) and current transformer (AC) technologies to measure the beamlet current using the resultant magnetic flux. These sensors measure the current of five beamlets, from DC to several MHz AC [12][13][14].…”
Section: Jinst 18 C07019mentioning
confidence: 99%
“…The ions are extracted from the Ion Source (biased by the AGPS power supply with respect to ground) by the Extraction Grid, which Beamlet currents in different positions have been measured using two different configurations of the RP board. Continuous data acquisition provides information about the average current density and uniformity [18], whereas the event-driven acquisition provides information about the beam current fluctuations (MHz range) due to the plasma oscillations produced by the RF field generating the plasma [19,20]. Two different sensors have been used for continuous and event-driven data acquisition, respectively, as shown in Figure 5.…”
mentioning
confidence: 99%
“…Other applications concerning the FAST acquisition mode are shown i Finally, the internal assembly of the data acquisition module is show where the layout of the six RP boards also assures high insulation capabilit case) among the channels. Other applications concerning the FAST acquisition mode are shown in detail in [20]. Finally, the internal assembly of the data acquisition module is shown in Figure 8, where the layout of the six RP boards also assures high insulation capability (5 kV for this case) among the channels.…”
mentioning
confidence: 99%