2017 Symposium on VLSI Technology 2017
DOI: 10.23919/vlsit.2017.7998162
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First demonstration of vertically stacked ferroelectric Al doped HfO<inf>2</inf> devices for NAND applications

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Cited by 59 publications
(37 citation statements)
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“…In general, this peak could be ascribed to the mixed phases of cubic, tetragonal, and orthorhombic in HfO 2 thin films. However, because of their similar lattice parameters, it is difficult to unambiguously and quantitatively identify these phases. Among these phases, the orthorhombic phase is considered to be the cause of ferroelectricity. Particularly, during thermal annealing process, the ferroelectric orthorhombic phase could be stabilized or promoted in HfO 2 -based films, and this process normally requires high crystallization temperature. For HZO films, annealing at ∼500 °C is required to achieve feasible ferroelectricity .…”
Section: Resultsmentioning
confidence: 99%
“…In general, this peak could be ascribed to the mixed phases of cubic, tetragonal, and orthorhombic in HfO 2 thin films. However, because of their similar lattice parameters, it is difficult to unambiguously and quantitatively identify these phases. Among these phases, the orthorhombic phase is considered to be the cause of ferroelectricity. Particularly, during thermal annealing process, the ferroelectric orthorhombic phase could be stabilized or promoted in HfO 2 -based films, and this process normally requires high crystallization temperature. For HZO films, annealing at ∼500 °C is required to achieve feasible ferroelectricity .…”
Section: Resultsmentioning
confidence: 99%
“…As shown in Supplementary Table 1, the 1T1C FeRAM requires a large capacitor area ("footprint") and undergoes destructive readout. FeFET can realize non-distructive read and 3D vertical stack [9][10][11] . However, it cannot be used as a random-access memory.…”
mentioning
confidence: 99%
“…Ferroelectric (FE) doped-hafnia (HfO 2 ) holds promise as a lead-free material to reignite integrated ferroelectrics, enabling low-power, high-density non-volatile memory, and integrated sensors [1]. This has yielded a growing interest from both academic and industrial communities exploring theoretical and practical aspects of FE-HfO 2 , with demonstrations of scaled ferroelectric field effect transistors (FeFET) and random access memory (FeRAM), in planar and vertical architectures [2][3][4][5][6]. More generally, hafnia is one of the most studied binary oxide systems, it is compatible with existing complementary metal-oxide-semiconductor (CMOS) process technologies and is widely used as a gate dielectric in transistors.…”
Section: Introductionmentioning
confidence: 99%