2018 IEEE Micro Electro Mechanical Systems (MEMS) 2018
DOI: 10.1109/memsys.2018.8346531
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First microphones based on an in-plane deflecting micro-diaphragm and piezoresistive nano-gauges

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Cited by 7 publications
(9 citation statements)
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“…Another microphone introduced in ref. [133] includes four in-plane moving membranes and suspended Si NWs of 250 Â 250 nm 2 cross-sectional area placed between an anchor [131] Copyright 2018, IEEE. b) A microphone based on thick SOI technology: (i) 3D model of the microphone reveals the positioning of the electrodes, E, vent holes, V, and a close-up view of the embedded Si NW, G, in the membrane, M, (ii) SEM image in top view depicts M with a diameter of 706 μm, and (iii) the close-up SEM image of G reveals a CD of 315 nm and a length of 20.3 μm.…”
Section: Microphonesmentioning
confidence: 99%
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“…Another microphone introduced in ref. [133] includes four in-plane moving membranes and suspended Si NWs of 250 Â 250 nm 2 cross-sectional area placed between an anchor [131] Copyright 2018, IEEE. b) A microphone based on thick SOI technology: (i) 3D model of the microphone reveals the positioning of the electrodes, E, vent holes, V, and a close-up view of the embedded Si NW, G, in the membrane, M, (ii) SEM image in top view depicts M with a diameter of 706 μm, and (iii) the close-up SEM image of G reveals a CD of 315 nm and a length of 20.3 μm.…”
Section: Microphonesmentioning
confidence: 99%
“…Figure 6. a) Configuration of a Si NW-based microphone: (i) Schematic of the microphone, including the inlet vent, V, back cavity, B, and a close-up view of the in-plane deflecting beam, D, (ii) SEM image in top view depicts the mechanical structure that comprises D and the electrostatic actuator, E, (iii) close-up SEM image showing details of deflecting beam, D, hinge, H, and Si NW gages, G.Reproduced with permission [131]. Copyright 2018, IEEE.…”
mentioning
confidence: 99%
“…Sound wave pressure from the inlet deflects the microbeams in the plane of the base wafer which induces stress in the nanoguages. Another design with the same sensing mechanism as that of [54] has been proposed in [56] with a measured resonant frequency of 16 kHz. Piezoresistive microphones can be found in applications of fluidic mechanics [57,58] and aeroacoustics [52,59].…”
Section: Piezoresistive Microphonesmentioning
confidence: 99%
“…In recent years, many researchers have studied MEMS microphones because of their great performance, such as high sensitivities, low power consumption, suitable frequency responses, stability, and reliability, and several MEMS microphones have been developed including capacitance type [2][3][4][5], piezoelectric type [6][7][8][9] and piezoresistive type [10][11][12]. For example, Ganji et al [4] reported a MEMS capacitive microphone using a perforated diaphragm supported by Z-shape arms with a high open sensitivity of 2.46 mV/Pa, and a small size of 0.3 mm × 0.3 mm; Segovia-Fernandez et al [6] reported a MEMS piezoelectric acoustic sensor with a sensitivity of 0.68 mV/Pa; Rahaman et al [7] reported a MEMS piezoelectric acoustic sensor with very high signal-to-noise ratio; Lhermet et al [10] first reported a piezoresistive microphone based on an in-plane deflecting micro-diaphragm and piezoresistive nano-gauges with a small size and high sensitivity of 0.1 mV/Pa. Although those microphones fit well with MEMS technology and provide a good performance, the capacitive microphone has the problem that the capacitive plate is easy to absorb and adhere to [2], and the piezoelectric microphone has the problems of poor anti-interference ability and low signal-to-noise ratio, and the piezoresistive microphone has the problem of low sensitivity [8].…”
Section: Introductionmentioning
confidence: 99%
“…small size of 0.3 mm × 0.3 mm; Segovia-Fernandez et al [6] reported a MEMS piezoelectric acoustic sensor with a sensitivity of 0.68 mV/Pa; Rahaman et al [7] reported a MEMS piezoelectric acoustic sensor with very high signal-to-noise ratio; Lhermet et al [10] first reported a piezoresistive microphone based on an in-plane deflecting micro-diaphragm and piezoresistive nano-gauges with a small size and high sensitivity of 0.1 mV/Pa. Although those microphones fit well with MEMS technology and provide a good performance, the capacitive microphone has the problem that the capacitive plate is easy to absorb and adhere to [2], and the piezoelectric microphone has the problems of poor antiinterference ability and low signal-to-noise ratio, and the piezoresistive microphone has the problem of low sensitivity [8].…”
Section: Introductionmentioning
confidence: 99%