Copper iodide (CuI) has emerged as a promising p-type
semiconductor
material owing to its excellent carrier mobility, high transparency,
and solution processability. Although CuI has potential for numerous
applications, including perovskite solar cells, photovoltaic devices,
and thin-film transistors (TFTs), the close relationship between the
anion vacancy generation and the charge transport mechanism in CuI-based
devices is underexplored. In this study, we propose solution-processed
p-type CuI TFTs which were subject to the thermal annealing process
in air and vacuum atmospheres at temperatures of 100, 200, and 300
°C. The chemical states and surface morphologies of the CuI thin
films were systematically investigated, revealing the generation of
iodine vacancy states and the reduction of carrier concentration,
as well as increased film density and grain size according to the
annealing condition. Further, the effective role of the Al2O3 passivation layer on the electrical characteristics
of the solution-processed CuI TFTs is demonstrated for the first time,
where the Al2O3 precursor greatly enhanced the
electrical performance of the CuI TFTs, exhibiting a field-effect
mobility of 4.02 cm2/V·s, a subthreshold swing of
0.61 V/decade, and an on/off current ratio of 1.12 × 104, which exceed the values of CuI TFTs reported so far. Based on the
synergistic effects of the annealing process and the passivation layer
that engineered the iodine vacancy state and morphology of CuI, the
proposed CuI TFTs with the Al2O3 passivation
layer showed excellent reliability under 100 times repeated operation
and long-term stability over 216 h, where the transfer curves slightly
shifted in the positive direction of 1.36 and 1.88 V measured at a
current level of 10–6 A for the reliability and
stability tests, respectively. Thus, this work opens a new window
for solution-processed p-type CuI TFTs with excellent stability for
developing next-generation complementary logic circuits.