2021
DOI: 10.1007/s13726-021-00967-0
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Flame retardancy of an intumescent epoxy resin containing cyclotriphosphazene: experimental, computational and statistical studies

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Cited by 10 publications
(5 citation statements)
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“…In our previous studies [ 90 , 91 ], our group devised a method for synthesizing hexaglycidyl cyclotriphosphazene (HGCP) by condensing glycidol with hexachlorocyclotriphosphazene. This process involved a one-step reaction, encompassing the generation of a nucleophilic group through the deprotonation of the glycidol hydroxyl group, followed by nucleophilic substitution.…”
Section: Functional Organic Groups In the Phosphazene Ring: Propertie...mentioning
confidence: 99%
“…In our previous studies [ 90 , 91 ], our group devised a method for synthesizing hexaglycidyl cyclotriphosphazene (HGCP) by condensing glycidol with hexachlorocyclotriphosphazene. This process involved a one-step reaction, encompassing the generation of a nucleophilic group through the deprotonation of the glycidol hydroxyl group, followed by nucleophilic substitution.…”
Section: Functional Organic Groups In the Phosphazene Ring: Propertie...mentioning
confidence: 99%
“…Therefore, hexachlorocyclotriphosphazene (HCCP) has gradually attracted people's attention because of its strong ame retardancy and high reactivity. [12][13][14][15][16] The molecular structure of HCCP contains Cl, P and N elements simultaneously, which can form a P-N synergistic ame retardant system resulting in excellent ame retardant properties. Therefore, HCCP can be used in re retardant materials and self extinguishing materials.…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, HCCP can be used in re retardant materials and self extinguishing materials. [12][13][14] However, HCCP used as a ame retardant directly is prone to secondary pollution due to HCl produced by combustion. Functionalization HCCP can be easily obtained by nucleophilic substitution of Cl atoms bonded to phosphorus with a nucleophile including amine, alcohol, or water.…”
Section: Introductionmentioning
confidence: 99%
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“…As a kind of commercial thermosetting material, epoxy resins (EP) possess excellent mechanical strength, thermal stability, adhesion and electrical insulation [ 1 , 2 , 3 ]; therefore, they are widely used in the field of electronic information technology, such as packaging materials for electronic components, anti-corrosion coatings, etc. With the rapid development of semiconductor technology and integrated circuit integration, the heat generation of electronic components has increased dramatically in recent years.…”
Section: Introductionmentioning
confidence: 99%