Flame‐retardant, glass‐fabric‐reinforced epoxy resin laminates fabricated through a gradient distribution mode

Abstract

In general, epoxy resin (EP) glue mixed with a high content of flame retardants is used to coat glass fabrics layer by layer to prepare fire‐retardant printed circuit boards (PCBs). However, the addition of the flame retardants not only increases the cost but also greatly deteriorates the processability and mechanical properties of the PCBs. In this study, a gradient distribution mode of composite flame retardants was designed and applied in EP‐based PCB composites. Unlike the traditional uniform distribution mode, in which flame retardants are evenly distributed in every resin layer, the gradient mode concentrates a higher content of the flame retardants on the surface layer, and the concentrations are gradually reduced along the thickness. In this way, the surface resin can quickly form a condensed charring barrier to hold back fire; this effectively protects the underlying resin, which has lower contents of flame retardant. The results of this study show that PCB prepared by the gradient mode obtained satisfactory flame retardance (a UL94 V‐0 rating) with only a 3.5 wt % total amount of flame retardant; this value was much lower than that (6.3 wt %) of composites featuring a uniform distribution. Additionally, the gradient mode also maintained the mechanical properties of PCB better. The tensile, impact, and flexural strengths of the gradient distribution system were obviously higher than those of the uniform distribution one with the same content of flame retardant. On the basis of the mode, a more economic and efficient technology was developed to manufacture flame‐retardant layered PCB. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017, 134, 44369.

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