2015
DOI: 10.1021/ie504333f
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Flame Retarding Cyanate Ester Resin with Low Curing Temperature, High Thermal Resistance, Outstanding Dielectric Property, and Low Water Absorption for High Frequency and High Speed Printed Circuit Broads

Abstract: High-end electric products require high frequency and high speed printed circuit broads (HFS-PCBs), while high performance resin is the key for fabricating HFS-PCBs. A new resin system (DPDP/CE) was developed by copolymerizing 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DPDP) and 2,2′-bis(4-cyanatophenyl) propane (CE). Compared with CE resin postcured at 250 °C for 4 h, the DPDP/CE system that was only postcured at 220 °C for 2 h has outstanding flame retardancy, greatly reduce… Show more

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Cited by 53 publications
(31 citation statements)
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“…Cyanate ester resins (CEs) and networks fall within the versatile class of thermosetting polymers and display a number of unique properties such as low dielectric constants, increased thermal stability, improved mechanical strength, high glass transition temperatures ( T g ), high flame retardancy and improved processability …”
Section: Introductionmentioning
confidence: 99%
“…Cyanate ester resins (CEs) and networks fall within the versatile class of thermosetting polymers and display a number of unique properties such as low dielectric constants, increased thermal stability, improved mechanical strength, high glass transition temperatures ( T g ), high flame retardancy and improved processability …”
Section: Introductionmentioning
confidence: 99%
“…Multiwalled carbon nanotubes containing hydroxyl groups have exhibited the most dramatic catalytic effect on the polymerization of bisphenol E cyanate ester (CE) resin . 2,5‐Dihydroxyphenyl‐9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DPDP) decreased the curing peak of the DPDP/CE system by 21–76 °C compared with that of the CE resin . Additionally, phosphorus‐containing hybridized multiwalled carbon nanotubes (PMWCNTs) lowered the curing temperature of PMWCNT/CE composites by 45–71 °C …”
Section: Introductionmentioning
confidence: 99%
“…Cyanate ester (CE) resin is one of important thermosetting materials for the encapsulation of electronic devices for its nice mechanical property, excellent dielectric property, and low water absorption performance , and widely used as prefabricating structure/function integration materials . More specifically, after adding a small amount of filler, the CE composites still have good dielectric properties.…”
Section: Introductionmentioning
confidence: 99%