Flame-synthesized nickel-silver nanoparticle inks provide high conductivity without sintering

Mohammadi, Mohammad Moein; Gunturi, Santosh Srivatsa; Shao, Shikuan; Konda, Shailesh; Buchner, Raymond D.; Swihart, Mark T.

doi:10.1016/j.cej.2019.04.141

Cited by 30 publications

(13 citation statements)

References 39 publications

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“…Besides, the coatings presented in our paper were mainly composed of Ni-Ag NPs, doped with only 1% of Ag NPs; therefore, their additional advantage, in comparison with that based on Ag NPs, is a lower price [28]. Mohammadi et al [29], achieved the highest electrical conductivity (4.22 × 10 5 S/m) for the mixture of Ni and Ag NPs (50:50 wt%) after sintering at 300 • C. However, the obtained value was much lower in comparison to the ones achieved in the presented studies, even if the applied sintering temperature was higher. The value of sheet resistance previously obtained for coatings based on Ni-Ag NPs was found to be 11 mΩ/ [11].…”

Section: Fabrication Of Ink Formulation and Conductive Coatingsmentioning

confidence: 92%

Nanocomposite Inks Based on Nickel–Silver Core–Shell and Silver Nanoparticles for Fabrication Conductive Coatings at Low-Temperature Sintering

Pajor-Świerzy

Szendera

Pawłowski

et al. 2021

Colloids and Interfaces

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Nanocomposite inks composed of nickel–silver core–shell and silver nanoparticles (NPs) can combine the advantages of lower cost, high conductivity, and low-temperature sintering processes, which have attracted much attention in the development of materials for printed flexible electronics. In this context, in the present paper, we report the process of preparation of nanocomposite ink containing nickel–silver core–shell nanoparticles, as the main filler, and silver nanoparticles, as doping material, and their application for the fabrication of conductive coatings. It was found that the addition of a low concentration of Ag NPs to ink formulation based mainly on low-cost Ni-Ag NPs improves the conductive properties of coatings fabricated by ink deposition on a glass substrate. Two types of prepared nanocomposite ink coatings showed promising properties for future application: (1) doped with 0.5% of Ag NPs sintered at 200 °C as low cost for larger industrial application and, (2) containing 1% of Ag NPs sintered at 150 °C for the fabrication of conductive printed patterns on flexible substrates. The conductivity of such nanocomposite films was similar, about of 6 × 106 S/m, which corresponds to 35% of that for a bulk nickel.

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Section: Fabrication Of Ink Formulation and Conductive Coatingsmentioning

confidence: 92%

Nanocomposite Inks Based on Nickel–Silver Core–Shell and Silver Nanoparticles for Fabrication Conductive Coatings at Low-Temperature Sintering

Pajor-Świerzy

Szendera

Pawłowski

et al. 2021

Colloids and Interfaces

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Section: Introductionmentioning

confidence: 99%

“…Alternatively, researchers have adopted some low-cost metals, e.g., copper [11], nickel [12], and aluminum [13], as conductive fillers to prepare high-performance inks. However, oxidation is an unavoidable issue [12,14]. To balance the cost and performance/stability, graphene stands out as a promising candidate for conductive fillers that possess desirable electrical properties and excellent stability [15][16][17][18].…”

Section: Introductionmentioning

confidence: 99%

Molecule bridged graphene/Ag for highly conductive ink

Yan

Zhang

et al. 2022

Sci. China Mater.

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Printing is a method of additive manufacturing that can reduce material costs and environmental contamination during the fabrication process. Ag ink is commonly used in printed electronics, such as interconnects, inductors, and antennas. However, the high cost of noble Ag restricts its massive applications. To reduce the cost of the state-of-the-art Ag ink and realize large-scale manufacturing, we develop a molecule-bridged graphene/Ag (MB-G/A) composite to produce highly conductive and cost-effective paperbased electronics. Graphene can be used to substitute part of Ag nanoparticles to reduce costs, form a conducive percolation network, and retain a reasonable level of conductivity. We adopt cysteamine as a molecular linker, because it anchors on the surface of graphene via the diazonium reaction. Additionally, the thiol functional group on the other end of cysteamine can bond to a Ag atom, forming a molecular bridge between graphene and Ag and promoting electron transport between Ag and graphene. As a result, the maximum conductivity of MB-G/A inks can reach 2.0 × 10 5 S m −1 , enabling their successful application in various printable electronics. In addition, the optimum MB-G/A ink costs less than half as much as pure Ag inks, showing the great potential of MB-G/A ink in commercial electronic devices.

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“…Moreover, it can be a viable option for the large‐scale manufacturing of nanoscale catalysts from low‐cost sources. [ 21,22 ] On the other hand, most FAS strategies focus mainly on producing singular or binary metallic nanoparticles through the pyrolysis and subsequent oxidation of precursors at high temperatures to accelerate the nucleation and condensation of pyrolyzed precursors, [ 23,24 ] even though it is even affordable for the production of G nanosheets in a single‐pass configuration unlike the preparations based on vacuum vapor deposition and the Hummers’ method. [ 25–27 ]…”

Section: Introductionmentioning

confidence: 99%

Coaxial Multiphase Flame for Continuous‐Flow Assembly of Ternary Nanocomposite Photocatalysts

Kwak

Prakash

Lim

et al. 2022

Adv Funct Materials

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For the low-cost production of graphene (G)-included composites, the growth of graphene on a transition metal in hydrocarbon flames is introduced, where the hydrocarbons are adsorbed on the metal surface, followed by catalytic decomposition, leading to continuous G formation. On the other hand, the flame synthesis of G is still a batch process, limiting the practical applications of such materials. Moreover, the hybridization of G for enhanced catalytic activities requires additional reaction and separation steps. Here, a coaxial multiphase flame is generated and combined with a rotating Cu-Ni foil and ultrasonic bath for the continuous-flow assembly of ternary G composites with low-cost and rapid implementation. The continuous flows to generate a multicomponent flame consist of MoS 2 particle-laden N 2 gas (inner), titanium isopropoxide vapor-laden CH 4 -air (middle), and ethanol liquid (outer), while Cu-Ni foil plies between the flame and ultrasonic bath for the assembly and dispersion of MoS 2 -TiO 2 @G composites. The configuration of the composite can be modulated by replacing the MoS 2 flow with a CdS flow to construct CdS-TiO 2 @G. From photocatalytic H 2 production and CO 2 reduction tests, the developed coaxial flame provides comparable performance with analogous architectures from the usual multistep methods despite the highthroughput production.

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Flame-synthesized nickel-silver nanoparticle inks provide high conductivity without sintering

Cited by 30 publications

References 39 publications

Nanocomposite Inks Based on Nickel–Silver Core–Shell and Silver Nanoparticles for Fabrication Conductive Coatings at Low-Temperature Sintering

Nanocomposite Inks Based on Nickel–Silver Core–Shell and Silver Nanoparticles for Fabrication Conductive Coatings at Low-Temperature Sintering

Molecule bridged graphene/Ag for highly conductive ink

Coaxial Multiphase Flame for Continuous‐Flow Assembly of Ternary Nanocomposite Photocatalysts

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