Flat is not dead: Current and future performance of Si-MEMS Quad Mass Gyro (QMG) system

Trusov, Alexander A.; Atikyan, G.; Rozelle, D. M.; Meyer, A. D.; Zotov, Sergei A.; Simon, Brenton R.; Shkel, Andrei M.

doi:10.1109/plans.2014.6851383

Cited by 53 publications

(14 citation statements)

References 7 publications

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“…Then, under external angular velocity, the Coriolis force which is perpendicular to the driving direction and the direction of angular velocity is applied to the mass. The external angular velocity can be obtained by measuring the Coriolis force [3], [4]. As shown in Fig.…”

Section: Design Of Tdsc a Analysis For Thermal Deformation Of Simentioning

confidence: 99%

“…Mechanical deformation is an important factor affecting the performance of sensors. Some MEMS devices such as gyroscope [3], [4], pressure sensor [5], [6], and accelerometer [7] work on the principle of force conversion. In such cases, these sensors convert the external signals (acceleration, angular velocity, pressure) to electrical signals, and detect the electrical signals to achieve high-precision measurement.…”

Section: Introductionmentioning

confidence: 99%

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Thermal Deformation Suppression Chip Based on Material Symmetry Design for Single Center Supported MEMS Devices

Xing

Zhou

Zhang³

et al. 2020

IEEE Access

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Structural thermal deformation is an important factor that affects the performance of MEMS devices. The mismatch of thermal expansion coefficient (CTE) between different materials is a major source. For single center supported MEMS devices, expansion difference between device and the substrate leads to the out of plane thermal deformation of the structure, resulting in the performance deterioration. This paper presents a thermal deformation suppression chip (TDSC) for single center supporting MEMS devices. It is fabricated by the MEMS process and consists of an upper plate and a lower plate. The materials of the upper and lower plates are the same as those of the device substrate and structure respectively. The principle of TDSC to suppress thermal deformation is material symmetry design. Single center anchor is adapted to connect the upper and lower plates. Besides, the center anchor can also isolate the packaging stress generated between TDSC and package shell. In this paper, center supported quadruple mass gyroscope (CSQMG) is used to verify the effect of TDSC. Finite element simulation shows that the thermal deformation suppression effect is determined by radius of TDSC anchor, and the deformation can be suppressed to 0. The conclusion is confirmed by White light interference experiment. In addition, the experiment results also show that the TDSC effectively reduce the thermal out-of-plane deformation after packaging, which is even better than that of the gyroscope without any packaging. It is further proved that TDSC can also significantly improve the temperature performance of the CSQMG. Moreover, the TDSC has simple process steps, small chip area, low cost, and is suitable for various MEMS devices with single center anchor. INDEX TERMS CTE mismatch, single center supported, material symmetry, thermal deformation suppression chip, packaging stress isolation.

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Section: Design Of Tdsc a Analysis For Thermal Deformation Of Simentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Thermal Deformation Suppression Chip Based on Material Symmetry Design for Single Center Supported MEMS Devices

Xing

Zhou

Zhang³

et al. 2020

IEEE Access

View full text Add to dashboard Cite

show abstract

“…Relative to the earlier QMG which measured 8 × 8 mm 2 [18,19], the device presented in this paper is 16 times smaller in area and is vacuum-sealed at the wafer-level using the episeal process [20]. The resonator is formed from a 40 µm thick single-crystal silicon layer, encapsulated at a low pressure (1 Pa) by an epitaxial silicon layer in order to achieve high Q (85 000).…”

Section: Designmentioning

confidence: 99%

Operation of a high quality-factor gyroscope in electromechanical nonlinearities regime

Taheri-Tehrani

Defoort

Horsley

2017

J. Micromech. Microeng.

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This paper describes the operation of a high quality factor gyroscope in various regimes where electromechanical nonlinearities introduce different forms of amplitude-frequency (A-f ) dependence. Experiments are conducted using an epitaxially-encapsulated 2 × 2 mm 2 quad-mass gyroscope (QMG) with a quality factor of 85 000. The device exhibits thirdorder Duffing nonlinearity at low bias voltages (15 V) due to the mechanical nonlinearity in the flexures and at high bias voltages (35 V) due to third-order electrostatic nonlinearity. At intermediate voltages (~26 V), these third-order nonlinearities cancel and the amplitudefrequency dependence is greatly reduced. A model is developed to demonstrate the connection between the electromechanical nonlinearities and the amplitude-frequency dependence, also known as the backbone curve. Gyroscope operation is demonstrated in each nonlinear operating regime and the key performance measures of the gyroscope's performance, angle random walk (ARW) and bias instability, are measured as a function of drive-mode vibration amplitude. We find that low ARW can be achieved even though the gyroscope's drive mode exhibits large amplitude-frequency dependence, and that bias instability is largely independent of the operating regime.

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“…Microelectromechanical system sensors have been well developed and widely used in consumer electronics, as well as automobile and healthcare fields. Although the MEMS industry is booming, it appears that several kinds of MEMS sensors have reached their fundamental accuracy limit [2,3]. It is difficult to improve the practical resolution limit further as the fabrication process and signal conditioning capabilities have reached a bottleneck state.…”

Section: Introductionmentioning

confidence: 99%

Resolution limit of mode-localised sensors

Zhang

Chang

2020

Sci. China Inf. Sci.

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Flat is not dead: Current and future performance of Si-MEMS Quad Mass Gyro (QMG) system

Cited by 53 publications

References 7 publications

Thermal Deformation Suppression Chip Based on Material Symmetry Design for Single Center Supported MEMS Devices

Thermal Deformation Suppression Chip Based on Material Symmetry Design for Single Center Supported MEMS Devices

Operation of a high quality-factor gyroscope in electromechanical nonlinearities regime

Resolution limit of mode-localised sensors

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