2021
DOI: 10.3390/s22010268
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Flaw Detection in Highly Scattering Materials Using a Simple Ultrasonic Sensor Employing Adaptive Template Matching

Abstract: Ultrasonic sensors have been extensively used in the nondestructive testing of materials for flaw detection. For polycrystalline materials, however, due to the scattering nature of the material, which results in strong grain noise and attenuation of the ultrasonic signal, accurate detection of flaws is particularly difficult. In this paper, a novel flaw-detection method using a simple ultrasonic sensor is proposed by exploiting time-frequency features of an ultrasonic signal. Since grain scattering mostly happ… Show more

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Cited by 4 publications
(3 citation statements)
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“…However, the absorption term is usually insignificant and negligible when compared to the scattering term; therefore, the attenuation model can be expressed as: where is the velocity of the sound in stainless steel and is the time delay of the pulse. In practice, the attenuation coefficient can be estimated beforehand [ 27 ]. Generally, the spectrum of the transmitted pulse possesses a Gaussian shape with the following form: where is the center frequency of the transmitted pulse, is a parameter that describes the frequency bandwidth of the transmitted pulse.…”
Section: Modeling Of Ultrasonic Ndt Signalmentioning
confidence: 99%
“…However, the absorption term is usually insignificant and negligible when compared to the scattering term; therefore, the attenuation model can be expressed as: where is the velocity of the sound in stainless steel and is the time delay of the pulse. In practice, the attenuation coefficient can be estimated beforehand [ 27 ]. Generally, the spectrum of the transmitted pulse possesses a Gaussian shape with the following form: where is the center frequency of the transmitted pulse, is a parameter that describes the frequency bandwidth of the transmitted pulse.…”
Section: Modeling Of Ultrasonic Ndt Signalmentioning
confidence: 99%
“…The traditional chip defect detection technology is usually used to detect and identify the defect information such as cracks, white spots, defects, and internal defects contained in the target chip sample by inspection methods such as magnetic particle inspection method, penetrant inspection method, eddy current inspection method, ultrasonic inspection method, and X-ray inspection [4][5][6][7][8][9][10]. Despite the achievements of traditional chip defect detection methods, there are some drawbacks.…”
Section: Introductionmentioning
confidence: 99%
“…The early identification of flaws allows for timely corrective actions, reducing the likelihood of unexpected failures and potential safety hazards. It also helps extend the service life of components and structures, optimize maintenance schedules, and minimize downtime, leading to enhanced operational efficiency and cost savings (Wu & Huang, 2021).…”
Section: Introductionmentioning
confidence: 99%