Flex Reliability of RFID Inlays Assembled by Anisotropic Conductive Adhesive

An, Bing; Cai, Xiong‐hui; Chu, Huaqiang; Lai, Xiao-wei; Wu, Fengshun; Wu, Yiping

doi:10.1109/hdp.2007.4283562

Cited by 14 publications

(5 citation statements)

References 1 publication

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“…ACAs have been widely used in flip chip packaging applications recently [22] [23]. It provides both electrical and mechanical connections between chip pads and the substrate.…”

Section: A Assembly Processmentioning

confidence: 99%

A Hybrid Low Power Biopatch for Body Surface Potential Measurement

Yang

Chen

Xie

et al. 2013

IEEE J. Biomed. Health Inform.

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“…ACAs have been widely used in flip chip packaging applications recently [22] [23]. It provides both electrical and mechanical connections between chip pads and the substrate.…”

Section: A Assembly Processmentioning

confidence: 99%

A Hybrid Low Power Biopatch for Body Surface Potential Measurement

Yang

Chen

Xie

et al. 2013

IEEE J. Biomed. Health Inform.

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“…It is a quantitative failure analysis and reliability evaluation method adopted to improve system's reliability by calculating system's failure probability. Pareto diagram indicates issues that potentially require the most improvement by showing relative frequency or critical [10,11].…”

Section: Discussionmentioning

confidence: 99%

Analysis and Study on RFID Tag Failure Phenomenon

Cho

Chul

Park

et al. 2013

Lecture Notes in Electrical Engineering

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RFID tag failure analysis test involves analysis of general devices and interpretation of analysis results, which suggests failure mechanism. Hence, it can only be performed by failure analysis experts with rich expertise and experience. Interpretation of causal relationship between a failure phenomenon and explainable causes of the failure has to rely on failure analyzers' knowledge and experience. Analyzers have the capability to figure out the precise failure mechanism because they know which type of a failure is associated with which failure mechanism. Failure mechanism by major failure type frequently observed in RFID tag and analysis method should be fully recognized by analyzers.

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“…A simple and practical test was therefore developed to evaluate the bonding strength of ACP bonded joints. There was a little change in our previous work (An et al, 2007). In short, the static tensile test and the bend test were designed.…”

Section: Reliability Analyzing Of Rfid Tag Inlays Assembled By Acpmentioning

confidence: 99%

“…RFID tag inlays were assembled with the adhesive prepared here through a hot-press process. The microstructures analysis of bonding joints, bonding strength test (An et al, 2007) and high-temperature and humidity test (85 8C, 85 percent relative humidity) were employed to evaluate the reliability of tag inlays assembled by ACP. Results of tests of mechanical and electrical properties of RFID tag inlays are presented.…”

Section: Introductionmentioning

confidence: 99%

Assembly of flexible RFID tag inlays with anisotropic conductive paste (ACP)

Cai

An²,

Wu³

et al. 2009

Circuit World

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Purpose -The purpose of this paper is to accomplish the low cost mass-production of flexible radio frequency identification (RFID) tag inlays. Design/methodology/approach -An anisotropic conductive paste (ACP) is prepared by mixing uniform micro-sized spherical conductive particles, latent curing agent and other additives into a thermoset epoxy resin. RFID tag inlays are assembled with the paste through flip-chip technology. The microstructural analysis of bonded joints, bond strength testing, and high-temperature and humidity aging testing are employed to evaluate the performance of the inlays. Findings -It was found that the chips are hard assembled on the antennae by the ACP. Flexible RFID tag inlays assembled using the presented method have good reliability when working under high frequency (13.56 MHz) conditions.Research limitations/implications -The method presented is a promising new way for packaging flexible RFID tag inlays with ACP. Through the use of flip-chip technology, large-scale production is possible with low manufacturing costs. Originality/value -The paper details a simple way to prepare an anisotropic conductive paste and to assemble flexible RFID tag inlays. The technique uses flip-chip technology with the paste as the electrical and mechanical interconnection material. It presents a simple and fast method of assembly for flexible RFID tag inlays on a large-scale with low cost.

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Flex Reliability of RFID Inlays Assembled by Anisotropic Conductive Adhesive

Cited by 14 publications

References 1 publication

A Hybrid Low Power Biopatch for Body Surface Potential Measurement

A Hybrid Low Power Biopatch for Body Surface Potential Measurement

Analysis and Study on RFID Tag Failure Phenomenon

Assembly of flexible RFID tag inlays with anisotropic conductive paste (ACP)

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