Flexible embedded circuitry: A novel process for high density, cost effective electronics

Brand, Jeroen van den; Kusters, Roel; Barink, M.; Dietzel, Andreas

doi:10.1016/j.mee.2009.11.004

Cited by 32 publications

(21 citation statements)

References 15 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The process for making the embedded circuitry is discussed in detail elsewhere [2]. Grooves with an initial width of 25 µm and a depth of 10 µm were photoablated into the foil using a KrF excimer laser (λ = 248 nm, repetition rate 300 Hz, energy 10 mJ/pulse).…”

Section: Methodsmentioning

confidence: 99%

“…For use in fine pitch applications (i.e. pitches/line widths below 50 µm) bonding on circuitry made with the 'embedded circuitry' process [2] was investigated. Embedded circuitry is a novel process developed at the Holst Centre which allows making fine pitch (down to 25 µm) electronic circuitry but still using standard screen printing pastes and equipment.…”

Section: Introductionmentioning

confidence: 99%

“…Several novel technologies are and have been under development worldwide to manufacture low cost fine pitch electronic circuitry [3][4][5][6][7][8][9]. At the Holst Centre, a technology called 'embedded circuitry' has been developed [2]. The process consists of direct laser writing of grooves in a foil according to the required pattern and then filling these again with conductive screen printing paste using a screen printer squeegee.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Flipchip bonding of ultrahin Si dies onto PEN/PET substrates with low cost circuitry

Brand

Kusters

Heeren

et al. 2010

3rd Electronics System Integration Technology Conference ESTC

Self Cite

View full text Add to dashboard Cite

All-printed, cost effective, smart electronic products are expected to be used in a wide range of applications and in large quantities in our society. The substrate material for these applications will be low cost materials like PEN or PET foils. For the functionality of the printed electronics product it often will still be required to integrate a Si chip. To keep the flexibility of the package and not to add too much to the thickness, the chip needs to be integrated into the product as a bare, thinned die. Because of the low temperature stability of the PEN and PET and the use of printed conductors it is necessary to interconnect the chip using an adhesive. The current paper specifically addresses the challenges associated with this. Research efforts will be discussed on the flip chip bonding of ultrathin (i.e. thickness 20 µm) bare chips on printed circuitry on both PEN and PET foils using a typical anisotropic conductive adhesive (ACA). Based on the results it can be concluded that a reproducible, low contact resistance and a good lifetime and flexural durability can be achieved over a wide range of bonding forces and temperatures. IntroductionRecently a new class of flexible electronics is starting to emerge which is most effectively termed 'printed electronics'. This term often refers to all-printed, cost effective, smart electronic products that will find a wide range of applications in large quantities in our society. Examples include cheap sensor packages attached to food packaging to measure the ripeness of food, smart bandages that monitor the healing of wounds and smart active or passive RFID tags. These cost effective packages can include all-printed functional structures like conductive circuitry, OLED pixels, photodiodes and logics based on organic materials.The substrate material will in most cases not be polyimide as commonly used in the more traditional flexible electronics. By using polyesters like PEN (polyethylene naphtalate) or PET (polyethylene teraphtalate), the substrate costs can be reduced by a factor of 5-10 [1]. A disadvantage of polyesters is however that they are considerably less thermally stable. PEN has a glass transition temperature (T g ) of ~130o C and PET of ~85 o C while poly(imide) has a T g of ~350 o C) [1]. This limitation in thermal stability excludes many well established processes for making electronic products and/or renders the use of existing processes much more challenging.A tangible example of such a printed electronics product is the disposable smart pill blister that is under development at the Holst Centre and its industrial partners. A photograph of a first prototype of it is shown

show abstract

Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Flipchip bonding of ultrahin Si dies onto PEN/PET substrates with low cost circuitry

Brand

Kusters

Heeren

et al. 2010

3rd Electronics System Integration Technology Conference ESTC

Self Cite

View full text Add to dashboard Cite

show abstract

“…Additive manufacturing technologies employing, metal, dielectric, polymer, and semiconducting materials are creating a world of possibilities decoupling product development time and complexity of design [1][2][3]. Besides the ability to manufacture highly complex parts at high resolution, the high recycling rate of additive manufacturing leads to a reduction of material waste compared to conventional subtractive manufacturing processes.…”

Section: Introductionmentioning

confidence: 99%

Direct digital additive manufacturing technologies: Path towards hybrid integration

Joshi

Dehoff

Duty

et al. 2012

2012 Future of Instrumentation International Workshop (FIIW) Proceedings

View full text Add to dashboard Cite

In the past decade, additive manufacturing and printed electronics technologies have expanded rapidly on a global scale. As the additive manufacturing techniques have become more capable and affordable, and able to work with a broader range of materials, the machines are increasingly being used to make advanced products at significantly lower costs and risks. The additive manufacturing industry is populated by a broad family of technologies, and the present paper provides an overview of key additive manufacturing technologies and their impact on materials processing, device applications, and future markets. Our R&D efforts on the development of core technologies for the realization of flexible electronics, and 3D microscale structures are also highlighted.

show abstract

“…In the past few years, additive material and device manufacturing techniques have been extensively investigated to meet the manufacturing technology demands of enhanced functionality, reduced material usages, smaller device dimensions, and higher throughput. [1][2][3][4][5][6] The emerging industry of organic, flexible, and printed electronics is bringing about new opportunities for large-scale, low-cost realization of advanced electronic devices. The range of materials which can be directly processed by additive manufacturing techniques to realize a complete electronic system is growing rapidly, and the material list includes polymer, ceramics, organic/inorganic semiconductors, biomaterials, conductive nanoparticles, dielectrics, ferromagnetic materials, and superconductors.…”

mentioning

confidence: 99%

Impact of Pulse Thermal Processing on the Properties of Inkjet Printed Metal and Flexible Sensors

Joshi

Kuruganti

Killough

2015

ECS J. Solid State Sci. Technol.

View full text Add to dashboard Cite

We report on the low temperature processing of environmental sensors employing pulse thermal processing (PTP) technique to define a path toward flexible sensor technology on plastic, paper, and fabric substrates. Inkjet printing and pulse thermal processing technique were used to realize mask-less, additive integration of low-cost sensors on polymeric substrates with specific focus on temperature, humidity, and strain sensors. The printed metal line performance was evaluated in terms of the electrical conductivity characteristics as a function of post-deposition thermal processing conditions. The PTP processed Ag metal lines exhibited high conductivity with metal sheet resistance values below 100 m / using a pulse width as short as 250 μs. The flexible temperature and relative humidity sensors were defined on flexible polyimide substrates by direct printing of Ag metal structures. The printed resistive temperature sensor and capacitive humidity sensor were characterized for their sensitivity with focus on future smart-building applications. Strain gauges were printed on polyimide substrate to determine the mechanical properties of the silver nanoparticle films. The observed electrical properties of the printed metal lines and the sensitivity of the flexible sensors show promise for the realization of a high performance print-on-demand technology exploiting low thermal-budget PTP technique. In the past few years, additive material and device manufacturing techniques have been extensively investigated to meet the manufacturing technology demands of enhanced functionality, reduced material usages, smaller device dimensions, and higher throughput. [1][2][3][4][5][6] The emerging industry of organic, flexible, and printed electronics is bringing about new opportunities for large-scale, low-cost realization of advanced electronic devices. The range of materials which can be directly processed by additive manufacturing techniques to realize a complete electronic system is growing rapidly, and the material list includes polymer, ceramics, organic/inorganic semiconductors, biomaterials, conductive nanoparticles, dielectrics, ferromagnetic materials, and superconductors. Printed electronics by contact-free, inkjet based direct-write techniques show promise for use in a wide range of active and passive device applications, such as wearable electronics, electronic packaging, solid state lighting, photovoltaics, radio-frequency identification (RFIDs), wireless communication, biomedicine, and flexible displays. 7-15 Smart sensor systems combined with microsensor technology enable the capabilities to make units that are small, smart, and multifunctional. These advancements in sensor technology have the potential to revolutionize diverse technology platforms including building retrofits. Buildings consume up to 40% of energy produced in the US. 16,17 Advanced sensors and controls have the potential to reduce the energy consumption of the buildings by 20-40%. 18,19 Currently, installation and wiring costs for sensors are signifi...

show abstract

Flexible embedded circuitry: A novel process for high density, cost effective electronics

Cited by 32 publications

References 15 publications

Flipchip bonding of ultrahin Si dies onto PEN/PET substrates with low cost circuitry

Flipchip bonding of ultrahin Si dies onto PEN/PET substrates with low cost circuitry

Direct digital additive manufacturing technologies: Path towards hybrid integration

Impact of Pulse Thermal Processing on the Properties of Inkjet Printed Metal and Flexible Sensors

Contact Info

Product

Resources

About